5SGSMD4E3H29C4G

The 5SGSMD4E3H29C4G is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) in a 780‑ball BGA FCBGA package. It delivers high on‑chip capacity with 360,000 logic elements and approximately 19.46 Mbits of embedded RAM to support dense, FPGA‑based system designs.

Built for commercial temperature operation and surface‑mount assembly, this device provides 360 user I/Os, a low core voltage range (0.82–0.88 V), and RoHS compliance for standard production deployments.

Key Features

• Core Capacity  360,000 logic elements to implement large combinational and sequential logic designs.
• Embedded Memory  Total on‑chip RAM of 19,456,000 bits (approximately 19.46 Mbits) for buffers, FIFOs, and local storage.
• I/O Density  360 I/Os for broad external connectivity and complex board interfacing.
• Power and Voltage  Core supply voltage specified from 820 mV to 880 mV to match targeted power domains and system power rails.
• Package and Mounting  780‑BBGA FCBGA package (supplier device package: 780‑HBGA, 33×33) optimized for surface‑mount PCB assembly.
• Temperature Grade  Commercial grade operation from 0 °C to 85 °C suitable for standard commercial environments.
• Compliance  RoHS compliant to meet common environmental requirements for commercial products.

Typical Applications

• High‑capacity digital processing  Use the large logic element count and embedded RAM to implement complex custom datapaths, state machines, and protocol engines.
• High‑density I/O systems  360 I/Os enable interfacing to multiple peripherals, mezzanine modules, or multi‑lane bus architectures on a single device.
• FPGA‑based system prototyping  Commercial development and verification platforms that require substantial on‑chip logic and memory resources.

Unique Advantages

• High integration: 360,000 logic elements with ~19.46 Mbits of RAM consolidate complex functionality on a single FPGA device.
• Extensive I/O count: 360 I/Os provide flexibility for I/O‑heavy designs without immediate need for external multiplexing logic.
• Production‑ready packaging: 780‑ball BGA FCBGA in a 33×33 supplier package supports standard surface‑mount assembly processes.
• Commercial temperature suitability: Rated 0 °C to 85 °C for deployment in conventional commercial environments.
• Regulatory readiness: RoHS compliance simplifies integration into lead‑free manufacturing flows.

Why Choose 5SGSMD4E3H29C4G?

The 5SGSMD4E3H29C4G positions itself as a high‑capacity Stratix V GS FPGA option for commercial designs that require substantial on‑chip logic and memory resources alongside a large I/O complement. Its defined voltage range, commercial operating temperature, and 780‑ball BGA package make it suitable for PCB designs that prioritize integration and density.

Engineers designing complex digital systems, proof‑of‑concept platforms, or high‑I/O boards will find this device well suited to consolidate functionality and reduce external component needs while aligning with standard commercial manufacturing and environmental requirements.

Request a quote or submit an RFQ to receive pricing, availability, and ordering information for the 5SGSMD4E3H29C4G.