5SGSMD4E3H29C4WN

The 5SGSMD4E3H29C4WN is a Stratix® V GS field programmable gate array (FPGA) in a 780-BBGA FCBGA package. It combines high logic capacity and substantial embedded RAM with a high pin-count I/O footprint to support complex, high-density programmable logic designs.

Designed for commercial-temperature applications, this device offers 360,000 logic elements, approximately 19.456 Mbits of embedded memory, and 360 I/O pins, delivering integration and I/O bandwidth for demanding FPGA-based implementations.

Key Features

• Core logic density — 360,000 logic elements to implement large-scale combinational and sequential logic designs.
• On-chip memory — Approximately 19.456 Mbits of embedded RAM for high-capacity buffering, lookup tables, and state storage.
• I/O capability — 360 I/O pins to support complex interfacing and multi-channel connectivity.
• Power — Core supply voltage range of 820 mV to 880 mV to match system power-rail requirements.
• Package and mounting — 780-BBGA FCBGA package (supplier package: 780-HBGA, 33×33) with surface-mount construction for board-level integration.
• Operating range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental compliance — RoHS-compliant for regulatory and assembly requirements.

Typical Applications

• FPGA-based prototyping and hardware acceleration — Large logic capacity and substantial embedded RAM enable complex algorithm implementation and system-level emulation.
• High-density I/O bridging and interfacing — 360 I/O pins support multi-protocol interfacing, parallel I/O lanes, and dense connector requirements.
• Memory-intensive logic — Approximately 19.456 Mbits of on-chip RAM for packet buffers, FIFOs, and fast local storage in data-path designs.

Unique Advantages

• High integration density: 360,000 logic elements reduce external glue logic and allow larger designs to fit on a single device.
• Substantial embedded memory: Approximately 19.456 Mbits of RAM supports on-chip data storage for throughput and latency-sensitive functions.
• Extensive I/O resources: 360 I/O pins accommodate multiple high-pin-count interfaces without external multiplexing.
• Compact, board-friendly packaging: 780-BBGA (33×33) surface-mount package enables high-density PCB layouts while maintaining robust connectivity.
• Commercial-grade operation: Rated for 0 °C to 85 °C operation, suitable for standard commercial electronics deployments.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGSMD4E3H29C4WN?

The 5SGSMD4E3H29C4WN Stratix V GS FPGA is positioned for designers who need a high-density, high-I/O programmable device with significant on-chip memory. Its combination of 360,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 360 I/O pins offers a balanced platform for integrating complex digital logic, buffering, and multi-interface connectivity into a single device.

With a compact 780-BBGA surface-mount package and commercial-temperature rating, this device delivers an integrated solution that supports scalable system designs while meeting common environmental and assembly requirements.

Request a quote or submit your procurement inquiry today to learn more about availability and lead times for the 5SGSMD4E3H29C4WN.