5SGSMD4E3H29I3LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 360 19456000 360000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,840 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4E3H29I3LG – Stratix® V GS FPGA, 360 I/Os, 360,000 Logic Elements
The 5SGSMD4E3H29I3LG is an Intel Stratix V GS field-programmable gate array (FPGA) supplied in a 780-BBGA FCBGA package. It provides a large programmable fabric with 360,000 logic elements and approximately 19.456 Mbits of embedded memory for complex, compute- and I/O-intensive designs.
Designed for industrial-grade applications, this device combines high I/O density, a compact surface-mount package, and defined electrical operating conditions to support large-system integration where a high-capacity FPGA fabric and robust thermal range are required.
Key Features
- Logic Capacity 360,000 logic elements to implement large digital designs and complex control logic.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffering, packet processing, and state storage.
- I/O Density 360 user I/Os to support multiple parallel interfaces, high-pin-count peripherals, and board-level connectivity.
- Power and Core Voltage Core supply voltage range specified at 820 mV to 880 mV, enabling defined power planning and regulator selection.
- Package and Mounting 780-BBGA FCBGA package (supplier device package: 780-HBGA, 33 × 33 mm) in a surface-mount form factor for PCB integration.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
- Standards Compliance RoHS compliant to support lead-free assembly and regulatory requirements.
- Documentation Support Device is part of the Stratix V family; electrical and switching characteristics are documented in the Stratix V device datasheet for design and validation reference.
Typical Applications
- High-density network processing Use the large logic capacity and abundant on-chip RAM to implement packet processing, classification, and buffering functions.
- Telecom and communications systems 360 I/Os and Stratix V family transceiver capabilities (as documented in the device datasheet) support complex interface and backplane integration.
- Industrial control and automation Industrial temperature range and high logic density enable programmable motion control, realtime processing, and I/O aggregation in harsh environments.
- High-performance embedded systems Deploy as the central programmable fabric for compute-accelerated embedded platforms that require extensive logic and memory resources.
Unique Advantages
- Large programmable fabric: 360,000 logic elements provide headroom for complex algorithms, multi-function systems, and future design growth.
- Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for buffering and state retention.
- High I/O count: 360 I/Os simplify board-level routing for multi-interface designs and minimize the need for external I/O expanders.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
- Predictable power envelope: Defined core voltage range (820–880 mV) aids power-supply design and thermal planning.
- Surface-mount BBGA package: 780-BBGA / 780-HBGA (33 × 33 mm) package offers a compact, manufacturable footprint for high-density PCBs.
Why Choose 5SGSMD4E3H29I3LG?
The 5SGSMD4E3H29I3LG positions itself as a high-capacity, industrial-grade Stratix V GS FPGA suitable for large-scale programmable designs that require extensive logic, memory, and I/O. Its combination of 360,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 360 I/Os enables consolidation of complex functions onto a single device while maintaining a defined core voltage and industrial thermal range for robust deployment.
This device is well suited to engineering teams building high-density communication, network processing, industrial control, or compute-accelerated embedded systems that require a documented Stratix V device architecture and clear electrical characteristics for system design and validation.
Request a quote or submit an inquiry to check pricing and availability for the 5SGSMD4E3H29I3LG. Our team can provide lead-time and ordering information to support your project schedule.

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