5SGSMD4E3H29I4G

The 5SGSMD4E3H29I4G is a Stratix V GS family FPGA offering high on-chip logic and memory capacity in a 780-ball BGA package. It is delivered as an industrial-grade, surface-mount device with a broad operating temperature range and a low-voltage core supply.

Designed for complex digital integration, this device targets high-density logic implementations and high-pin-count I/O systems where scalable logic resources, embedded RAM, and robust operating conditions are required.

Key Features

• Logic Capacity  360,000 logic elements (logic cells) to implement large-scale digital designs and complex state machines.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM for buffering, FIFOs, and data-path storage.
• I/O Density  360 user I/Os to support wide parallel interfaces and multi-channel connectivity.
• Power and Core Voltage  Core supply specified from 820 mV to 880 mV to support the device’s internal logic and transceiver operation.
• Package and Mounting  Surface-mount 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33).
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Large logic capacity and embedded memory make this device suitable for complex digital processing and custom logic acceleration.
• Communications and signal processing  High I/O count and Stratix V GS family transceiver and I/O capabilities (series-level) accommodate multi-channel data paths and timing-critical interfaces.
• Industrial control and automation  Industrial temperature rating and robust package options support deployment in factory automation and control systems.

Unique Advantages

• Substantial logic resources: 360,000 logic elements enable implementation of large, complex designs without external glue logic.
• Generous embedded memory: Approximately 19.5 Mbits of on-chip RAM reduces dependence on external memory for buffering and data-path functions.
• High I/O availability: 360 I/Os provide the routing headroom needed for wide parallel interfaces and multi-peripheral designs.
• Industrial operating range: −40 °C to 100 °C supports reliable operation in demanding temperature environments.
• Compact BGA packaging: 780-ball FCBGA/HBGA package delivers high pin density in a surface-mount form factor for space-constrained boards.
• Standards-compliant manufacturing: RoHS compliance eases integration into compliant assemblies and supply chains.

Why Choose 5SGSMD4E3H29I4G?

This Stratix V GS FPGA provides a balanced combination of high logic density, substantial embedded memory, and extensive I/O in an industrial-grade BGA package. Its core voltage specification and operating temperature range are documented for designers who need predictable electrical and environmental behavior.

The 5SGSMD4E3H29I4G is well suited for teams building large-scale digital implementations, multi-channel communication interfaces, and industrial automation equipment that require integrated logic and memory capacity with a high-pin-count package.

Request a quote or submit an inquiry to evaluate 5SGSMD4E3H29I4G for your next high-density FPGA design.