5SGSMD4E3H29I4WN

The 5SGSMD4E3H29I4WN is a Stratix® V GS field programmable gate array (FPGA) IC from Intel. It delivers high-density programmable logic with extensive on-chip memory and a large I/O count for complex, integration-driven designs.

Designed for industrial-temperature operation, this device is suited to applications that require substantial logic capacity, significant embedded RAM, and a compact ball-grid array package for surface-mount assembly.

Key Features

• Core Logic — 360,000 logic elements providing high-density programmable logic capacity for complex FPGA implementations.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive algorithms.
• I/O Capacity — 360 available I/O pins to accommodate broad peripheral, interface, and system connectivity requirements.
• Package & Mounting — 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33); surface-mount mounting type for compact board integration.
• Power — Core voltage supply range of 820 mV to 880 mV to align with modern low-voltage FPGA power domains.
• Temperature & Grade — Industrial grade with an operating temperature range of −40°C to 100°C for reliable performance in harsh environments.
• Compliance — RoHS compliant, meeting common environmental requirements for electronic components.

Typical Applications

• High-density programmable systems — Implement large-scale logic and custom processing functions using the device’s 360,000 logic elements and abundant on-chip RAM.
• Communication and interface aggregation — Leverage 360 I/Os to consolidate multiple external interfaces and protocol bridges on a single FPGA.
• Industrial control and automation — Industrial-grade temperature range and robust packaging make the device suitable for industrial control, monitoring, and automation systems.
• Embedded compute and acceleration — On-chip memory and dense logic resources support hardware acceleration and real-time processing tasks within embedded platforms.

Unique Advantages

• Extensive logic capacity: 360,000 logic elements enable large designs and complex custom architectures without immediate scaling to multi-device solutions.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependency on external memory for many buffering and stateful applications.
• High I/O count: 360 I/Os simplify system connectivity by supporting multiple interfaces and peripherals directly on the FPGA.
• Industrial operating range: Rated from −40°C to 100°C to withstand demanding environmental conditions in industrial deployments.
• Compact BGA footprint: 780-ball FCBGA packaging (780-HBGA, 33×33 supplier package) delivers a dense, surface-mount form factor for space-constrained boards.
• RoHS compliant: Meets environmental compliance expectations for modern electronic assemblies.

Why Choose 5SGSMD4E3H29I4WN?

The 5SGSMD4E3H29I4WN places a large complement of logic elements, substantial embedded memory, and a high I/O count into a compact 780-ball BGA package, all while supporting industrial-temperature operation and low-voltage core domains. It is well suited for engineers building high-density, memory-intensive, and I/O-rich FPGA designs that require robust environmental performance.

Backed by Stratix V documentation and Intel’s device datasheet, this FPGA is positioned for designs that demand scalability, integration, and a clear specification set for procurement and system-level planning.

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