5SGSMD4E3H29I3WN

The 5SGSMD4E3H29I3WN is an Intel Stratix® V GS field programmable gate array (FPGA) offered in an industrial temperature grade. It delivers high logic density and substantial on-chip memory with a broad set of I/O for designs that require extensive programmable logic and routing resources.

As a member of the Stratix V family, the device is described in the Stratix V device datasheet for electrical and switching characteristics, including operating conditions and transceiver information. This part is designed for surface-mount assembly in a 780-BBGA (FCBGA) package and is RoHS compliant.

Key Features

• Logic Capacity  360,000 logic elements suitable for large-scale programmable logic implementations.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Resources  360 user I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Voltage Supply  Core voltage operating range of 820 mV to 880 mV to match system power rails and maintain specified operating conditions.
• Package and Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33). Surface-mount mounting type for modern PCB assembly.
• Temperature Grade  Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital logic  Large programmable designs that require extensive logic resources and embedded memory for state machines, protocol engines, and control logic.
• Data processing and acceleration  On-chip RAM and plentiful logic elements enable custom datapaths, buffering, and inference or signal processing blocks.
• Communications and networking  High I/O count supports wide parallel interfaces and multi-lane connectivity commonly used in networking cards and protocol bridging.
• Industrial control and instrumentation  Industrial temperature grade and robust packaging suit automation, test equipment, and factory-control applications.

Unique Advantages

• High logic density: 360,000 logic elements provide the capacity to implement complex, large-scale programmable designs without immediate migration to a different device family.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM reduces external memory dependency and simplifies board-level designs for buffering and data flow.
• Extensive I/O count: 360 I/Os enable flexible interfacing to multiple subsystems and high-pin-count parallel buses.
• Industrial-grade temperature range: Rated for −40 °C to 100 °C operation to support reliable deployment in harsher thermal environments.
• Compact BGA packaging: 780-BBGA (FCBGA) in a 33×33 supplier package footprint provides a high pin density in a compact form factor for space-constrained PCBs.
• Standards-aligned documentation: Device electrical and switching characteristics are covered in the Stratix V datasheet to support design integration and qualification.

Why Choose 5SGSMD4E3H29I3WN?

The 5SGSMD4E3H29I3WN positions itself where high logic capacity, significant embedded memory, and a large I/O complement are required within an industrial temperature envelope. Its Stratix V lineage means designers can reference established device documentation for electrical and switching characteristics while targeting dense, programmable implementations.

This device is suitable for engineering teams building complex digital systems that demand on-chip resources, flexible interfacing, and a robust temperature range. The combination of logic, memory, and I/O helps reduce external component count and supports scalable, long-lived designs.

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