5SGSMD4H1F35C1G

The 5SGSMD4H1F35C1G is an Intel Stratix V GS field-programmable gate array (FPGA) delivered in a 1152-ball FCBGA package. It provides high-density programmable logic and a large I/O count suitable for complex digital system integration.

With 360,000 logic elements and approximately 19.456 Mbits of embedded memory, this commercial-grade device supports designs that demand significant on-chip logic, memory capacity, and flexible I/O connectivity while operating at a low core supply voltage.

Key Features

• Core Logic — 360,000 logic elements and 135,840 logic blocks provide substantial programmable fabric for complex designs and large-scale integration.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and data-path acceleration without external memory for many functions.
• I/O Capacity — 432 user I/Os to accommodate wide parallel interfaces, multi-channel connectivity, and flexible board-level integration.
• Power and Voltage — Core voltage supply range from 870 mV to 930 mV to meet targeted power-rail designs and core performance points.
• Package & Mounting — 1152-ball BGA (1152-FBGA, 35×35) in an FCBGA package with surface-mount mounting for compact, high-density board layouts.
• Temperature & Grade — Commercial grade with an operating temperature range of 0°C to 85°C for standard commercial applications.
• Regulatory — RoHS compliant, supporting lead-free manufacturing requirements.

Typical Applications

• High-density digital systems — Implement large-scale logic, custom datapaths, and control fabrics where significant on-chip logic and memory are required.
• Multi-channel I/O platforms — Drive systems that need hundreds of I/Os for parallel interfaces, aggregation, or multi-lane connectivity.
• Prototyping and complex FPGA-based designs — Use as a development target for designs that benefit from a large logic resource pool and substantial embedded RAM.

Unique Advantages

• High integration density: 360,000 logic elements and extensive embedded RAM reduce external component count and simplify board-level design.
• Large I/O complement: 432 I/Os enable broad interface support and flexible pinout options for diverse system requirements.
• Compact, manufacturable package: 1152-ball FCBGA (35×35) supports surface-mount assembly in space-constrained designs without sacrificing connectivity.
• Low core voltage operation: 0.87–0.93 V supply range supports designs targeting lower-power core rails and modern power architectures.
• Commercial temperature grade: Rated for 0°C to 85°C, aligning with standard commercial electronics operating environments.
• RoHS compliance: Facilitates integration into lead-free manufacturing flows.

Why Choose 5SGSMD4H1F35C1G?

The 5SGSMD4H1F35C1G positions itself as a high-density Stratix V GS FPGA option for commercial applications that require significant programmable logic, substantial on-chip memory, and a high I/O count in a compact FCBGA package. Its combination of 360,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 432 I/Os makes it suitable for complex digital systems, multi-channel interface platforms, and advanced prototyping.

Engineers specifying this device benefit from a commercially graded, RoHS-compliant FPGA with a low core voltage operating window and a package tailored for high-density board designs, supporting scalability and integration within demanding development timelines.

Request a quote or submit an RFQ to check availability and pricing for the 5SGSMD4H1F35C1G. Technical documentation is available for deeper electrical and timing specifications to support your design evaluation.