5SGSMD4H1F35C2G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 430 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H1F35C2G – Stratix V GS Field Programmable Gate Array (FPGA)

The 5SGSMD4H1F35C2G is a Stratix® V GS field programmable gate array (FPGA) from Intel, supplied in a 1152‑ball FCBGA package. It provides a high density of programmable logic, embedded memory, and I/O to support complex, high‑pin‑count system designs.

Built for commercial applications, this device combines 360,000 logic elements with approximately 19.456 Mbits of embedded RAM and 432 user I/O pins, enabling integration of large digital designs where high I/O count and on‑chip memory are required.

Key Features

  • Core Logic  360,000 logic elements to implement complex programmable logic and custom system functions.
  • Logic Array Blocks  135,840 logic array blocks supporting large, hierarchical logic implementations.
  • Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM for buffering, caching, and data‑path storage.
  • I/O Density  432 user I/O pins to interface with multiple parallel buses, external devices, and board-level peripherals.
  • Package  1152‑BBGA (FCBGA) supplier package; 1152‑FBGA (35×35) physical footprint for compact, high‑density board layouts.
  • Power  Core supply range 0.870 V to 0.930 V to match system power‑rail requirements.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Mounting  Surface mount package suitable for standard PCB assembly processes.
  • Environmental  RoHS compliant.
  • Series Documentation  Stratix V device datasheets provide electrical and switching characteristics, including transceiver and I/O timing details for system design and validation.

Typical Applications

  • High‑density I/O systems  Leverage 432 I/O pins to aggregate multiple parallel interfaces or connect to high‑pin‑count daughter cards and mezzanines.
  • Large digital designs  Use 360,000 logic elements and extensive on‑chip RAM to implement complex state machines, datapaths, and custom accelerators.
  • System integration and prototyping  Combine programmable logic and embedded memory to validate system architectures and integrate mixed subsystems on a single device.

Unique Advantages

  • High logic capacity: 360,000 logic elements enable implementation of extensive logic functions without excessive partitioning across devices.
  • Significant on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for buffering and intermediate storage.
  • Broad I/O capability: 432 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, or parallel buses on a single board.
  • Compact high‑ball‑count package: 1152‑BBGA (35×35) package supports dense PCB designs while maintaining a broad pinout for system connections.
  • Commercial availability: Device is specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
  • Documented electrical characteristics: Series datasheets cover electrical, switching, and I/O timing parameters to support design validation and system integration.

Why Choose 5SGSMD4H1F35C2G?

The 5SGSMD4H1F35C2G positions itself as a high‑capacity, commercially graded Stratix V GS FPGA option for designers requiring substantial programmable logic, embedded RAM, and high I/O density in a single device. Its combination of 360,000 logic elements, approximately 19.456 Mbits of on‑chip RAM, and 432 I/O pins supports integration of complex digital functions while minimizing external component count.

Intel’s Stratix V family documentation provides the electrical and switching characteristics you need for power budgeting and signal‑integrity planning. This device is suited to teams implementing large FPGA‑based designs that demand on‑chip memory, plentiful I/O, and a compact high‑ball‑count package for board‑level integration.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGSMD4H1F35C2G.

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