5SGSMD4H1F35C2N

The 5SGSMD4H1F35C2N is a Stratix V GS field programmable gate array (FPGA) offered in a 1152-ball BGA (FCBGA) package for surface-mount assemblies. It is built on the Stratix V architecture and the 28-nm process and targets transceiver-enabled, DSP-centric, high-bandwidth applications.

This device combines high logic density with abundant embedded memory and DSP resources, plus integrated transceivers, making it suitable for data‑intensive applications such as optical transport, high-performance computing, broadcast, and other wireline communications systems.

Key Features

• Process & core voltage — Stratix V family architecture implemented on a 28‑nm process; documented core voltage options include 0.85 V or 0.9 V, with this part specified for a supply range of 870 mV to 930 mV.
• Logic density — 360,000 logic elements provide large-scale programmable logic capacity for complex designs.
• Embedded memory — Approximately 19.46 Mbits of on-chip RAM implemented with M20K-type memory blocks for buffering, packet buffering, and intermediate data storage.
• High-performance DSP — Stratix V GS family includes abundant variable-precision DSP blocks (family-level support up to 3,926 18×18 or 1,963 27×27 multipliers) to support demanding signal-processing algorithms.
• Integrated transceivers — GS devices include integrated transceivers with 14.1‑Gbps data-rate capability, enabling robust backplane and optical interface designs.
• I/O and packaging — 432 device I/Os in a 1152‑BBGA (1152‑FBGA, 35×35) FCBGA package; surface-mount mounting suited to dense board designs.
• Clocking and system IP — Redesigned adaptive logic modules (ALMs), fractional PLLs, multi-track routing, and an Embedded HardCopy Block for hardening IP (for PCIe Gen3/Gen2/Gen1 instantiations at the family level).
• Commercial grade & compliance — Commercial operating grade with an ambient operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Transceiver-based DSP systems: High-density DSP resources and integrated transceivers make this device suitable for broadcast processing, software-defined radio front ends, and high-performance compute acceleration.
• Optical and backplane communications: Integrated transceivers and large on-chip memory support 40G/100G-class transport and backplane interfaces that require high bandwidth and buffering.
• Network processing and packet handling: Large logic capacity and embedded RAM address packet processing, traffic management, and protocol offload functions.
• Wireline and military communications systems: Architecture and transceiver capabilities accommodate demanding wireline and tactical communication links where DSP and high-speed I/O are required.

Unique Advantages

• High logic and memory capacity: 360,000 logic elements and approximately 19.46 Mbits of embedded memory reduce external component needs and enable larger, more integrated designs.
• DSP-rich architecture: Variable-precision DSP blocks at family scale provide direct implementation of multiply-accumulate and filtering operations with minimal external logic.
• Integrated high-speed I/O: On-chip transceivers with 14.1‑Gbps capability and 432 I/Os simplify high-bandwidth interface design and board routing.
• System IP and prototyping path: Embedded HardCopy Block and family-level support for hardened PCIe IP enable a low-risk prototyping path and potential migration toward HardCopy V ASICs.
• Package and assembly flexibility: 1152‑ball FCBGA (35×35) surface-mount package supports dense, high-I/O boards while remaining RoHS compliant.
• Predictable commercial thermal/power envelope: Commercial grade operating range (0 °C to 85 °C) and specified supply range (870 mV–930 mV) aid system power and thermal planning.

Why Choose 5SGSMD4H1F35C2N?

The 5SGSMD4H1F35C2N combines Stratix V GS architecture with high logic density, substantial embedded memory, extensive DSP resources, and integrated transceivers—attributes well suited for high-throughput, DSP-heavy, transceiver-centric systems. Its commercial-grade rating and surface-mount FCBGA packaging make it appropriate for production systems where performance and board density are priorities.

As part of the Stratix V family, this device supports a clear prototyping-to-production path and family-level hardening options, helping teams scale from development to higher-volume deployments while preserving design investment.

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