5SGSMD4H1F35I2G

The 5SGSMD4H1F35I2G is a Stratix® V GS field-programmable gate array (FPGA) IC delivering a high-density, programmable logic fabric. It combines a large logic capacity with substantial embedded RAM and a high I/O count for complex, resource-intensive designs.

Targeted for industrial-grade applications, this device offers a wide operating temperature range and a compact 1152‑BBGA FCBGA package to support surface-mount integration in demanding environments.

Key Features

• Logic Capacity — 360,000 logic elements to implement large-scale programmable designs and complex digital functions.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for data buffering, FIFOs, and on-chip storage that reduces external memory dependence.
• I/O Count — 432 user I/Os to support extensive peripheral interfacing and multi-channel connectivity within a single device.
• Power and Voltage — Core supply operating range of 0.870 V to 0.930 V to match system power-rail planning.
• Package and Mounting — 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) designed for surface-mount assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• High-density programmable logic — Implements complex FPGA-based algorithms and custom accelerators where large logic and memory resources are required.
• Multi-channel I/O systems — Supports designs that require many parallel interfaces or extensive I/O routing within a single package.
• Industrial embedded systems — Suited for industrial deployments that require extended temperature operation and a compact surface-mount form factor.

Unique Advantages

• Large programmable fabric: 360,000 logic elements provide the capacity to consolidate multiple functions onto a single device, reducing BOM complexity.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM enable local data storage and buffering to improve system-level performance.
• High I/O density: 432 I/Os allow flexible partitioning of interfaces and connectivity without external I/O expanders.
• Industrial temperature operation: −40 °C to 100 °C rating supports reliable performance across a wide thermal range.
• Compact, manufacturable package: 1152‑BBGA FCBGA (35×35) package supports surface-mount production and dense board-level integration.
• Tight core-voltage spec: 0.870–0.930 V core supply range simplifies power-rail design and system integration.

Why Choose 5SGSMD4H1F35I2G?

The 5SGSMD4H1F35I2G combines high logic density, substantial embedded RAM, and a large I/O complement in a compact industrial‑grade package. It is positioned for designs that require consolidated functionality, extensive on-chip memory, and robust operation over a wide temperature range.

Engineers selecting this device benefit from a scalable, high-capacity FPGA platform that supports complex implementations while minimizing external components and board-level footprint.

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