5SGSMD4H2F35C1G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,824 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4H2F35C1G – Stratix® V GS FPGA IC, 1152‑BBGA (FCBGA)
The 5SGSMD4H2F35C1G is a Stratix V GS Field Programmable Gate Array (FPGA) IC in a 1152‑ball BGA package. It provides a high count of programmable logic elements and embedded memory with a large I/O complement for complex digital designs.
Designed for commercial‑grade applications, this device targets designs that require substantial on‑chip logic capacity, extensive I/O, and controlled low‑voltage core operation between 870 mV and 930 mV.
Key Features
- Logic Capacity 360,000 logic elements to implement large-scale programmable logic and complex functions on a single device.
- Embedded Memory Approximately 19.46 Mbits of on‑chip RAM for buffering, lookup tables, and embedded data storage.
- I/O Resources 432 I/O pins to support wide parallel interfaces and multiple peripheral connections.
- Power and Core Voltage Operates with a core voltage supply range of 870 mV to 930 mV, enabling designs that use low‑voltage core domains.
- Package & Mounting 1152‑BBGA (FCBGA) supply package, 1152‑FBGA (35×35) footprint; surface mount for high‑density board layouts.
- Commercial Grade Temperature Rated for 0 °C to 85 °C operation and specified as commercial grade.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
- Documented Family Datasheet Part of the Stratix V family with comprehensive electrical and switching characteristics available in the device datasheet.
Typical Applications
- High‑density programmable logic designs Use the 360,000 logic elements and large embedded memory to consolidate complex digital functions onto a single FPGA.
- I/O‑intensive systems Leverage 432 I/Os for broad parallel interfaces, multi‑lane bridging, and extensive peripheral connectivity.
- Prototyping and system integration Commercial‑grade FPGA capacity and a BGA package support board‑level prototyping and integration into compact system designs.
Unique Advantages
- High logic density: 360,000 logic elements allow implementation of large state machines, datapaths, and custom accelerators without multiple devices.
- Substantial on‑chip RAM: Approximately 19.46 Mbits of embedded memory reduces dependence on external RAM for many buffering and LUT needs.
- Extensive I/O: 432 I/Os enable flexible interfacing to a wide range of peripherals and parallel buses.
- Compact, manufacturable package: 1152‑BBGA (FCBGA) surface‑mount package supports high‑density PCB layouts and assembly processes.
- Commercial operating range: 0 °C to 85 °C rating and RoHS compliance align with standard commercial deployment requirements.
- Well‑documented family: Electrical and switching characteristics are provided in the Stratix V device datasheet for design and verification.
Why Choose 5SGSMD4H2F35C1G?
The 5SGSMD4H2F35C1G combines high logic capacity, substantial embedded memory, and a large I/O count in a single commercial‑grade Stratix V GS FPGA package. Its low‑voltage core operation and BGA footprint make it suitable for compact, high‑functionality designs that require significant on‑chip resources.
This device is appropriate for teams that need to consolidate complex digital functions, support many external interfaces, and rely on detailed device documentation for design and verification. The combination of density, I/O, and package choices delivers scalability and integration for demanding commercial FPGA applications.
Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for 5SGSMD4H2F35C1G.

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