5SGSMD4H2F35C2L

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 1,668 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H2F35C2L – Stratix® V GS FPGA (360,000 logic elements, 1152‑BBGA)

The 5SGSMD4H2F35C2L is a Stratix V GS field programmable gate array (FPGA) IC designed for DSP‑centric and transceiver‑based applications. Built around the Stratix V family architecture, it leverages a 28‑nm process and integrated hard IP blocks to deliver a high‑capacity, high‑performance programmable fabric.

With 360,000 logic elements, abundant variable‑precision DSP resources, integrated transceiver capability, and approximately 19.5 Mbits of embedded memory, this commercial‑grade device targets bandwidth and compute‑intensive markets such as networking, broadcast, and high‑performance computing.

Key Features

  • Core technology — Built on the Stratix V family 28‑nm process technology with an adaptive logic architecture tailored for high‑performance logic and DSP implementations.
  • Logic capacity — 360,000 logic elements to implement large, complex custom logic, control and datapath functions.
  • Embedded memory — Approximately 19.5 Mbits of on‑chip RAM (total RAM bits: 19,456,000) for buffering, packet processing, and on‑chip data storage.
  • DSP resources — Stratix V GS family offers a large array of variable‑precision DSP blocks suitable for high‑precision and high‑throughput signal processing workflows.
  • Integrated transceivers — GS devices provide integrated transceiver capability (family‑level specification) suitable for backplane and optical interfaces, enabling high‑speed serial connectivity in DSP‑centric designs.
  • I/O — 432 user I/O pins to support broad peripheral, memory, and interface connectivity.
  • Power — Core voltage operating range of 820 mV to 880 mV, enabling defined power‑rail planning for system designers.
  • Package and mounting — 1152‑BBGA (FCBGA) package, supplier device package: 1152‑FBGA (35×35); surface‑mount package suitable for production assembly.
  • Operating range & compliance — Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High‑performance DSP systems — Leverage the Stratix V GS variable‑precision DSP blocks and large logic capacity for signal processing workloads such as filtering, transforms, and channel building.
  • Network and transport equipment — Integrated transceiver capability and abundant on‑chip memory make this device suitable for packet processing, traffic management, and optical/backplane interfaces.
  • Broadcast and media processing — Use the FPGA’s compute density and memory to implement real‑time encoding, multiplexing, and format conversion pipelines.
  • Compute‑intensive accelerator modules — High logic and DSP resource counts enable custom acceleration for specialized compute tasks in high‑performance computing environments.

Unique Advantages

  • High programmable capacity: 360,000 logic elements provide the headroom to integrate complex system functions and large custom IP blocks on a single device.
  • Substantial on‑chip memory: Approximately 19.5 Mbits of embedded RAM reduces external memory dependency for buffering and low‑latency data paths.
  • DSP‑centric architecture: Stratix V GS family DSP resources enable variable‑precision arithmetic and high throughput for signal processing workloads.
  • Integrated high‑speed serial capability: Family‑level transceiver support facilitates high‑bandwidth links for network and optical interfaces.
  • Production‑ready package: 1152‑BBGA FCBGA (35×35) surface‑mount package supports volume assembly and thermal/mechanical integration into commercial systems.
  • Clear power envelope: Defined core supply range (820–880 mV) aids system power design and regulator selection.

Why Choose 5SGSMD4H2F35C2L?

The 5SGSMD4H2F35C2L combines a high logic element count, substantial embedded memory, DSP‑focused resources, and integrated transceiver capability in a production‑grade, RoHS‑compliant FCBGA package. It is well suited to designers building bandwidth‑ and compute‑intensive systems that require on‑device signal processing, high‑speed interfaces, and large programmable fabric.

This Stratix V GS device is targeted at teams developing networking, broadcast, and high‑performance computing equipment who need a scalable, reliable FPGA platform with clear power and thermal integration points and a strong family‑level feature set.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and additional integration support for the 5SGSMD4H2F35C2L.

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