5SGSMD4H2F35C2LG

The 5SGSMD4H2F35C2LG is a Stratix® V GS field programmable gate array (FPGA) IC from Intel, offered in a 1152-BBGA FCBGA package. This commercial‑grade FPGA combines a large logic capacity with substantial on‑chip RAM and a high I/O count to support complex digital designs.

With 360,000 logic elements, approximately 19.46 Mbits of embedded memory and 432 general‑purpose I/Os, the device is targeted at applications that require high integration density, extensive local buffering and flexible I/O connectivity while operating within standard commercial temperature and low-voltage core ranges.

Key Features

• Core Logic  360,000 logic elements provide a high-density programmable fabric for complex digital functions and system integration.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support data buffering, FIFOs and intermediate storage without external memory.
• I/O Capacity  432 user I/Os for broad interfacing options with peripherals, sensors, and external logic.
• Supply Voltage  Core supply operating range of 820 mV to 880 mV to match low-voltage power domains.
• Package & Mounting  1152‑BBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount FCBGA footprint for compact PCB integration.
• Temperature & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet common environmental and assembly requirements.

Typical Applications

• High‑density logic systems  Implement large custom logic blocks and system controllers using the device’s 360,000 logic elements.
• Memory‑intensive buffering  Use the approximately 19.46 Mbits of embedded RAM for packet buffering, FIFOs or intermediate data storage to reduce external memory needs.
• Multi‑I/O interfacing  Deploy in designs requiring many parallel interfaces or mixed signalling with 432 available I/Os.
• Compact, board‑level integration  Ideal for space‑constrained PCBs that need a high logic and I/O count in a 1152‑BBGA surface‑mount package.

Unique Advantages

• High logic density: 360,000 logic elements let you map large designs or consolidate multiple functions into a single FPGA.
• Significant on‑chip RAM: Approximately 19.46 Mbits of embedded memory reduces dependence on external DRAM for many buffering and storage tasks.
• Extensive I/O resources: 432 I/Os provide flexibility for parallel interfaces, dense connector implementations and board-level integration.
• Low‑voltage core support: Core supply range of 820–880 mV enables integration with low-voltage power domains.
• Commercial temperature suitability: Rated for 0 °C to 85 °C to meet standard commercial application environments.
• RoHS compliant packaging: Environmentally compliant assembly-ready BGA package for modern manufacturing processes.

Why Choose 5SGSMD4H2F35C2LG?

The 5SGSMD4H2F35C2LG delivers a balance of high logic capacity, embedded memory and I/O count in a compact 1152‑BBGA surface‑mount package, making it well suited for designs that require significant on‑chip resources without a large board footprint. Its low core voltage range and commercial operating temperature rating align with standard system power domains and deployment environments.

Backed by Intel’s Stratix V documentation, this FPGA is appropriate for engineering teams and procurement seeking a high‑density, RoHS‑compliant programmable device for prototypes and commercial products that demand integrated logic, memory and I/O in one package.

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