5SGSMD4H2F35C2LN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 543 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H2F35C2LN – Stratix® V GS FPGA, 360,000 logic elements, 432 I/Os, 1152‑FBGA

The 5SGSMD4H2F35C2LN is a Stratix V GS field programmable gate array (FPGA) delivered in a 1152‑ball FCBGA package (35 × 35). It combines high logic capacity, significant on‑chip memory, and a rich set of DSP and transceiver resources targeted at bandwidth‑ and DSP‑centric designs.

Built around Stratix V family architecture, this GS variant is intended for applications that require large FPGA fabrics with integrated transceivers and variable‑precision DSP capability, while operating within commercial temperature and low‑voltage supply ranges.

Key Features

  • Logic Capacity  Provides 360,000 logic elements to implement complex digital systems and large custom logic fabrics.
  • Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM organized in 20‑Kbit (M20K) memory blocks for buffer, FIFO, and data‑path storage.
  • DSP Resources  GS family devices offer abundant variable‑precision DSP blocks, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision signal processing workloads.
  • High‑Speed Transceivers  Integrated transceivers with 14.1 Gbps data‑rate capability (typical for GS devices) to support backplane and optical interface applications.
  • I/O and Package  432 user I/Os in a surface‑mount 1152‑FBGA (35×35) package suitable for compact, high‑density board designs.
  • Power and Temperature  Core supply range 820 mV to 880 mV and commercial operating temperature from 0 °C to 85 °C to match a wide set of production environments.
  • Fabric and Clocking  Stratix V architecture elements such as adaptive logic modules (ALMs) and fractional PLLs provide flexible fabric resources and clock management.
  • Integration Path  Includes Embedded HardCopy Block support in the Stratix V family for low‑risk, volume migration paths to hardIP/ASIC implementations where applicable.
  • Compliance  RoHS‑compliant construction.

Typical Applications

  • High‑Performance DSP Systems  Use the extensive DSP multiplier resources and on‑chip memory for signal filtering, beamforming, and real‑time processing tasks.
  • Optical and Backplane Interfaces  Integrated 14.1 Gbps transceivers enable implementation of high‑speed serial links for optical transport and backplane connectivity.
  • Network and Packet Processing  Large logic capacity and memory allow complex packet processing, traffic management, and protocol offload functions.
  • Compute and Acceleration Engines  Combine DSP blocks and wide fabric resources to implement custom acceleration for compute‑intensive workloads.

Unique Advantages

  • High logic density: 360,000 logic elements support large, complex designs without immediate migration to larger families.
  • Substantial embedded memory: Approximately 19.456 Mbits of M20K‑based memory reduces external memory dependency for many buffering and caching needs.
  • DSP and transceiver balance: Variable‑precision DSP fabric combined with 14.1 Gbps transceivers addresses applications that require both math throughput and high‑speed I/O.
  • Compact, high‑density package: 1152‑FBGA (35×35) package delivers many I/Os in a space‑efficient form factor for dense boards.
  • Commercial production ready: RoHS compliance and defined operating ranges support mainstream production and procurement processes.

Why Choose 5SGSMD4H2F35C2LN?

The 5SGSMD4H2F35C2LN offers a balanced mix of large logic capacity, significant on‑chip memory, variable‑precision DSP support, and high‑speed transceivers in a compact 1152‑ball FBGA package. It is positioned for designers building bandwidth‑ and DSP‑intensive systems that require a robust FPGA fabric within commercial temperature and low‑voltage operating ranges.

For projects that anticipate volume migration paths, the Stratix V family’s Embedded HardCopy capabilities provide a route to hardened IP/ASIC implementations. This device is suitable for teams that need a scalable, high‑performance programmable platform backed by the Stratix V architecture.

Request a quote or submit a parts inquiry to receive pricing, availability, and lead‑time information for the 5SGSMD4H2F35C2LN.

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