5SGSMD4H2F35C2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 1,300 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H2F35C2N – Stratix® V GS FPGA, 360,000 logic elements, 1152‑BBGA

The 5SGSMD4H2F35C2N is a Stratix V GS field-programmable gate array (FPGA) in a 1152‑BBGA (35×35) package. It is built on the Stratix V family architecture and is targeted at transceiver-enabled, DSP-centric and bandwidth-focused designs.

With 360,000 logic elements, approximately 19.456 Mbits of embedded memory, integrated transceivers and dedicated DSP resources, this commercial‑grade device is suited to data‑intensive applications such as high‑speed networking, optical transport and high‑precision digital signal processing.

Key Features

  • Core & process technology — Stratix V family architecture implemented in 28‑nm process technology; family-level features include redesigned adaptive logic modules (ALMs) and a comprehensive fabric clocking network.
  • Logic capacity — 360,000 logic elements to implement large, complex FPGA designs.
  • Embedded memory — Approximately 19.456 Mbits of on‑chip RAM organized in 20‑Kbit (M20K) memory blocks for buffering and data storage.
  • DSP resources — Variable‑precision DSP blocks suited for high‑precision signal processing; GS devices support up to 3,926 18×18 or 1,963 27×27 multipliers at the family level.
  • Integrated transceivers — Transceiver capability for 14.1‑Gbps class links on GS devices, supporting backplane and optical interface use cases.
  • Embedded HardCopy Block — Family-level embedded HardCopy Block available to harden IP instantiations of PCIe Gen3/Gen2/Gen1.
  • I/O and packaging — 432 user I/Os in a 1152‑BBGA (FCBGA) package; supplier package listed as 1152‑FBGA (35×35); surface‑mount mounting type.
  • Power and thermal — Device supply specified at 870 mV to 930 mV; commercial operating temperature range 0°C to 85°C.
  • Compliance — RoHS compliant.

Typical Applications

  • High‑bandwidth networking — Implement packet processing and transport functions for 40G/100G systems where high logic and memory capacity are required.
  • Optical and backplane interfaces — Use integrated 14.1‑Gbps transceivers for backplane and optical link implementations.
  • DSP‑centric systems — Deploy variable‑precision DSP blocks and abundant multipliers in broadcast, military, or high‑performance computing signal‑processing chains.
  • PCIe‑based acceleration — Leverage the Embedded HardCopy Block for hardened PCIe Gen3/Gen2/Gen1 IP instantiation in accelerator or interface cards.

Unique Advantages

  • High logic density: 360,000 logic elements provide capacity for large-scale FPGA designs, reducing the need for multiple devices.
  • Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM (M20K blocks) supports deep buffering and data‑intensive algorithms.
  • Transceiver‑enabled I/O: GS‑variant transceivers with 14.1‑Gbps capability support high‑speed serial links for optical and backplane applications.
  • Dedicated DSP fabric: Large numbers of variable‑precision DSP multipliers enable complex signal processing without external accelerators.
  • Compact, surface‑mount package: 1152‑BBGA (35×35) package provides high pin count in a compact footprint for dense board integration.
  • Commercial readiness: Commercial grade rating and RoHS compliance simplify integration into production equipment with standard environmental requirements.

Why Choose 5SGSMD4H2F35C2N?

The 5SGSMD4H2F35C2N delivers a combination of high logic capacity, significant on‑chip memory and transceiver capability within the Stratix V GS device family. It is positioned for designs that require transceiver‑based DSP processing and substantial logic and memory resources in a surface‑mount 1152‑BBGA package.

This device is suitable for engineers building data‑intensive networking, optical transport, and high‑precision DSP systems who need the Stratix V family features—such as M20K embedded memory, variable‑precision DSP blocks, and family‑level hard IP support—to meet performance and integration goals.

Request a quote or submit a purchase inquiry to receive pricing, availability and lead‑time information for the 5SGSMD4H2F35C2N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up