5SGSMD4H2F35C3WN

The 5SGSMD4H2F35C3WN is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) supplied in a 1152‑BBGA FCBGA package. This commercial‑grade FPGA integrates a large logic fabric, substantial on‑chip memory, and a high I/O count for designs that require significant programmable logic and connectivity.

Designed for applications that need up to 360,000 logic elements and approximately 19.456 Mbits of embedded memory, this device supports dense system integration with a surface‑mount 1152‑FBGA (35×35) package and a 432‑pin I/O footprint.

Key Features

• Logic Capacity  360,000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, state storage, and memory‑intensive logic functions.
• I/O  432 I/O pins enable broad external connectivity and flexible interfacing with peripherals and system components.
• Power Supply  Core voltage range of 820 mV to 880 mV to match system power rails and design constraints.
• Package & Mounting  1152‑BBGA (Supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact, board‑level integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for lead‑free manufacturing and environmental compatibility.

Typical Applications

• High‑density digital systems  Implements large programmable logic and embedded memory for complex control, signal processing, or protocol logic.
• Connectivity and I/O‑rich designs  Leverages 432 I/O pins to interface with multiple peripherals, sensors, or external transceivers.
• Embedded memory–dependent functions  Uses the device’s approximately 19.456 Mbits of RAM for buffering, packet handling, and temporary data storage.

Unique Advantages

• High logic density: 360,000 logic elements enable consolidation of large designs into a single FPGA, reducing board complexity.
• Significant embedded memory: Approximately 19.456 Mbits of on‑chip RAM reduces reliance on external memory for many applications.
• Robust I/O capability: 432 I/O pins provide flexibility for complex interfacing and multi‑domain connectivity.
• Compact system integration: 1152‑BBGA (35×35) surface‑mount package supports high‑density PCB layouts while maintaining a large logic and I/O count.
• Commercial operating range: Rated for 0 °C to 85 °C to match standard commercial electronic applications.
• RoHS compliant: Supports environmental and manufacturing requirements for lead‑free production.

Why Choose 5SGSMD4H2F35C3WN?

As a member of the Stratix V family, the 5SGSMD4H2F35C3WN delivers a balance of large logic capacity, embedded memory, and extensive I/O in a single commercial‑grade FPGA. Its 1152‑BBGA package and surface‑mount mounting make it suitable for compact, high‑density boards where integrating substantial programmable logic and memory on‑chip is a priority.

This device is well suited for engineering teams and procurement seeking a scalable, documented FPGA solution backed by Intel’s Stratix V device documentation and specifications. Its combination of logic resources, on‑chip RAM, and I/O count offers designers an integrated platform for complex digital systems and memory‑dependent functions.

Request a quote or submit an RFQ to receive availability and pricing information for the 5SGSMD4H2F35C3WN.