5SGSMD4H2F35I2L

The 5SGSMD4H2F35I2L is a Stratix® V GS field-programmable gate array (FPGA) IC built on the Stratix V family architecture. It combines a high logic capacity fabric with abundant DSP resources and integrated high-speed transceiver capability aimed at DSP-centric and transceiver-based designs.

Designed for industrial applications, this surface-mount FCBGA part provides a large I/O count and significant on-chip memory while operating across a wide supply and temperature range—making it suitable for high-bandwidth communications, signal processing, and compute-accelerated systems.

Key Features

• Core & Fabric — 360,000 logic elements implemented on the Stratix V architecture with a redesigned adaptive logic module (ALM) and a comprehensive fabric clocking network.
• Embedded Memory — Approximately 19.5 Mbits of on-chip RAM, with M20K memory block architecture for local high-speed storage and buffering.
• DSP Resources — Stratix V GS family offers a dense array of variable-precision DSP blocks; family devices support up to 3,926 18×18 or 1,963 27×27 multipliers for high-precision signal processing.
• Transceivers — GS-class Stratix V devices provide integrated transceivers with 14.1 Gbps data-rate capability for backplane and optical interface applications.
• I/O & Package — 432 I/O pins in a 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35); surface-mount mounting type for compact board integration.
• Power — Core voltage supply range of 820 mV to 880 mV to support the device’s high-performance fabric.
• Temperature & Grade — Industrial-grade operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Integration & Hard IP — Includes Embedded HardCopy Block capability to harden IP instantiation (used for PCIe Gen1/Gen2/Gen3 hard IP in the Stratix V family) and support low-risk migration to HardCopy V ASICs.
• Compliance — RoHS compliant.

Typical Applications

• High‑bandwidth Communications — Implement line cards, backplane interfaces, and optical transport functions where high I/O count and integrated transceivers are required.
• Digital Signal Processing — Deploy variable-precision DSP blocks and abundant multipliers for broadcast, wireline, and compute-accelerated signal processing workloads.
• Network and Packet Processing — Use the large logic and memory resources to build packet engines, traffic managers, and protocol offloads for networking equipment.
• Prototyping to ASIC Flow — Prototype high-volume designs on Stratix V GS FPGAs and leverage the documented HardCopy V path for low-risk, cost-effective ASIC migration.

Unique Advantages

• High Logic Density: 360,000 logic elements provide the capacity to implement complex system-on-chip functions in a single device.
• Significant On‑Chip Memory: Approximately 19.5 Mbits of embedded RAM (M20K blocks) reduce external memory dependency and improve throughput for buffering and packet processing.
• DSP‑Centric Architecture: Family-level DSP multiplier counts enable high-precision, high-throughput digital signal processing without extensive external accelerators.
• Integrated High‑Speed I/O: 432 I/O and multi-gigabit transceivers support demanding I/O and link requirements for modern communications systems.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to support deployments in harsh or temperature-variable environments.
• Path to HardCopy ASIC: Embedded HardCopy Block and family support facilitate a clear migration route from FPGA prototype to production ASIC when needed.

Why Choose 5SGSMD4H2F35I2L?

The 5SGSMD4H2F35I2L combines high logic capacity, substantial embedded memory, and a DSP-optimized fabric to address bandwidth- and compute-intensive designs. With 432 I/O, industrial temperature capability, and a compact 1152-FBGA package, it is well suited for engineers building high-performance communications, signal processing, and network infrastructure equipment.

Its family-level features—integrated transceivers, scalable DSP resources, and a documented migration path to HardCopy V ASICs—provide long-term design flexibility and the option to transition prototypes into higher-volume production without redesigning core IP.

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