5SGSMD4H2F35I2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 1,053 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H2F35I2N – Stratix® V GS FPGA, 360000 logic elements, 1152‑BBGA

The 5SGSMD4H2F35I2N is an Intel Stratix V GS field-programmable gate array (FPGA) in a 1152-BBGA (1152-FBGA, 35×35) package. It implements a 28-nm Stratix V architecture with an emphasis on high-precision DSP capability and integrated transceivers for bandwidth‑centric, transceiver‑based designs.

This industrial‑grade device combines large logic capacity, substantial on‑chip memory, and high I/O count to support data‑intensive applications such as wireline communications, broadcast and military communications systems, and high‑performance computing.

Key Features

  • Logic Capacity  360,000 logic elements for implementing large, complex digital designs.
  • Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, FIFOs, and large data structures.
  • DSP Resources  Stratix V GS family devices provide an abundance of variable‑precision DSP blocks (family documentation cites support for up to 3,926 18×18 or 1,963 27×27 multipliers), enabling high‑throughput signal processing implementations.
  • High‑Speed Transceivers  Integrated transceivers with 14.1 Gbps capability (Stratix V GS family), suitable for backplane and optical interface applications.
  • I/O and Integration  432 I/O pins to connect to high‑bandwidth peripherals and system interfaces.
  • Process and Core  Built on 28‑nm TSMC process technology with enhanced core architecture and integrated hard IP blocks for functions such as PCIe Gen3 (family‑level features documented in the Stratix V device overview).
  • Power  Core voltage range specified at 870 mV to 930 mV.
  • Package and Mounting  1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package for high‑density board integration.
  • Operating Range  Industrial operating temperature range from −40 °C to 100 °C.
  • RoHS Compliance  Device RoHS status: Compliant.

Typical Applications

  • Wireline Communications  Transceiver and DSP resources support backplane and optical transport functions in high‑bandwidth network equipment.
  • Broadcast and Military Communications  Variable‑precision DSP blocks and high‑speed I/O enable real‑time signal processing and interface handling for broadcast and defense systems.
  • High‑Performance Computing  Large logic capacity and substantial on‑chip memory support compute‑intensive acceleration and data‑path implementations.
  • Data‑Intensive Networking  Integrated transceivers and abundant logic make the device suitable for 40G/100G class networking and other bandwidth‑centric protocols.

Unique Advantages

  • High Logic Density: 360,000 logic elements provide the capacity to implement complex control, routing, and processing functions on a single device.
  • Substantial On‑Chip Memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependency for buffering and packet handling.
  • Rich DSP Resources: Family‑level variable‑precision DSP blocks enable efficient implementation of high‑precision signal processing algorithms.
  • Integrated High‑Speed Transceivers: 14.1‑Gbps capable transceivers (Stratix V GS family) simplify implementation of high‑bandwidth serial links.
  • Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployment in demanding environments.
  • Production Path: Stratix V family documentation highlights a path from FPGA prototyping to HardCopy V ASICs for higher‑volume production.

Why Choose 5SGSMD4H2F35I2N?

The 5SGSMD4H2F35I2N offers a combination of large logic resources, significant embedded memory, and integrated transceivers in a compact 1152‑BBGA package, making it well suited to transceiver‑centric DSP applications and data‑intensive networking designs. Its industrial temperature rating and RoHS compliance align with demanding application environments.

Designed within the Stratix V family, this device provides a clear prototyping and production pathway and leverages family‑level features such as high‑precision DSP blocks and hard IP blocks for common interfaces—all backed by Intel’s device documentation for design and migration planning.

Request a quote or submit an inquiry to receive pricing, availability, and additional ordering information for part number 5SGSMD4H2F35I2N.

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