5SGSMD4H2F35I2G

The 5SGSMD4H2F35I2G is a Stratix V GS field-programmable gate array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers a high-density programmable logic fabric with a large on-chip memory footprint and a broad I/O count for complex, system-level integration.

Designed as part of the Stratix V family, this device targets designs that require substantial logic capacity, significant embedded RAM, and robust I/O capability while operating across an extended industrial temperature range.

Key Features

• Core Logic  360,000 logic elements and 135,840 CLBs provide high logic capacity for large-scale programmable designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM (19,456,000 bits) to support buffering, packet processing, and memory-hungry logic functions.
• I/O Resources  432 user I/Os to support wide parallel interfaces and multiple high-pin-count peripherals.
• Power and Core Voltage  Specified core supply range of 870 mV to 930 mV for the device core power domain.
• Package and Mounting  1152-BBGA (FCBGA) package, supplier package listed as 1152-FBGA (35×35); surface-mount device for PCB assembly.
• Industrial Temperature Grade  Operating temperature range from –40 °C to 100 °C, enabling deployment in industrial environments.
• Regulatory Status  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic element count and CLBs support complex custom processing engines and compute-intensive algorithms.
• Memory‑intensive architectures  Approximately 19.456 Mbits of embedded RAM for frame buffering, packet queues, and on-chip data storage.
• Multi-interface systems  432 I/Os enable aggregation of parallel buses, wide data lanes, and numerous peripheral connections.
• Industrial control and automation  Industrial grade temperature range (–40 °C to 100 °C) suits deployment in factory and process-control equipment.

Unique Advantages

• High logic density: 360,000 logic elements give headroom for large, integrated designs and reduce the need for multiple devices.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory minimizes external memory dependence for many buffering and state-machine functions.
• Extensive I/O capability: 432 I/Os simplify board-level routing for multi-channel and multifunction systems.
• Industrial thermal range: Rated from –40 °C to 100 °C to meet thermal requirements of industrial deployments.
• Compact FCBGA package: 1152-ball FCBGA (35×35) offers a high pin count in a compact footprint for space-constrained designs.
• RoHS compliant: Conforms to RoHS directives for regulatory and environmental compliance.

Why Choose 5SGSMD4H2F35I2G?

The 5SGSMD4H2F35I2G combines large-scale programmable logic, significant embedded memory, and a broad I/O complement in an industrial-grade Stratix V GS device. Its core voltage range and FCBGA package provide designers with a compact, power-defined platform suitable for demanding system designs that require integration, deterministic on-chip resources, and extended-temperature operation.

This device is well suited to engineering teams building high-density, memory-aware FPGA solutions that must operate reliably in industrial environments while maintaining a high degree of system integration and board-level I/O flexibility.

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