5SGSMD4H2F35C3G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,385 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 135840 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGSMD4H2F35C3G – Stratix® V GS Field Programmable Gate Array (FPGA)
The 5SGSMD4H2F35C3G is a Stratix® V GS FPGA in a 1152-BBGA (35×35) FCBGA package designed for commercial temperature applications. It delivers a high-density logic fabric and substantial on-chip memory for complex digital designs requiring large logic capacity and extensive I/O.
This device is suited for designs that require high logic element counts, abundant embedded RAM, and a compact surface-mount package while operating within a commercial temperature range and a low-voltage core supply.
Key Features
- Core Logic 360,000 logic elements to implement large-scale digital designs and complex custom logic functions.
- Embedded Memory Approximately 19.46 Mbits of on-chip RAM for buffering, packet processing, and real-time data storage.
- I/O Capacity 432 general-purpose I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
- Power Core voltage supply range of 820 mV to 880 mV enabling operation at the specified low-voltage core domain.
- Package & Mounting 1152-BBGA (35×35) FCBGA surface-mount package providing a compact footprint for high-density PCB layouts.
- Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
- Compliance RoHS compliant to meet common environmental and regulatory requirements.
Unique Advantages
- High logic capacity: 360,000 logic elements enable integration of large-scale functions on a single device, reducing system complexity.
- Significant on-chip memory: Approximately 19.46 Mbits of embedded RAM supports buffering and local data handling without immediate external memory dependence.
- Extensive I/O: 432 I/O pins allow flexible interfacing options for parallel buses, sensor arrays, and multi-channel designs.
- Compact, board-friendly package: 1152-BBGA FCBGA (35×35) package helps maximize PCB density while keeping a surface-mount assembly process.
- Low-voltage core operation: 820 mV–880 mV supply range supports designs optimized for power-sensitive core domains.
- Commercial temperature grade: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
Why Choose 5SGSMD4H2F35C3G?
The 5SGSMD4H2F35C3G positions itself as a high-capacity Stratix® V GS FPGA option for commercial designs that require a large logic fabric, ample embedded RAM, and plentiful I/O in a compact FCBGA package. Its low-voltage core range and RoHS compliance make it suitable for modern, power-aware digital systems within the commercial temperature envelope.
This device is appropriate for engineering teams targeting integration density, on-chip memory resources, and robust I/O capability while leveraging the Stratix V device family characteristics documented in the available datasheet.
Request a quote or submit an inquiry to get pricing, availability, and additional technical details for the 5SGSMD4H2F35C3G.

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