5SGSMD4H2F35C3G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 1,385 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H2F35C3G – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSMD4H2F35C3G is a Stratix® V GS FPGA in a 1152-BBGA (35×35) FCBGA package designed for commercial temperature applications. It delivers a high-density logic fabric and substantial on-chip memory for complex digital designs requiring large logic capacity and extensive I/O.

This device is suited for designs that require high logic element counts, abundant embedded RAM, and a compact surface-mount package while operating within a commercial temperature range and a low-voltage core supply.

Key Features

  • Core Logic  360,000 logic elements to implement large-scale digital designs and complex custom logic functions.
  • Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for buffering, packet processing, and real-time data storage.
  • I/O Capacity  432 general-purpose I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
  • Power  Core voltage supply range of 820 mV to 880 mV enabling operation at the specified low-voltage core domain.
  • Package & Mounting  1152-BBGA (35×35) FCBGA surface-mount package providing a compact footprint for high-density PCB layouts.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
  • Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Unique Advantages

  • High logic capacity: 360,000 logic elements enable integration of large-scale functions on a single device, reducing system complexity.
  • Significant on-chip memory: Approximately 19.46 Mbits of embedded RAM supports buffering and local data handling without immediate external memory dependence.
  • Extensive I/O: 432 I/O pins allow flexible interfacing options for parallel buses, sensor arrays, and multi-channel designs.
  • Compact, board-friendly package: 1152-BBGA FCBGA (35×35) package helps maximize PCB density while keeping a surface-mount assembly process.
  • Low-voltage core operation: 820 mV–880 mV supply range supports designs optimized for power-sensitive core domains.
  • Commercial temperature grade: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.

Why Choose 5SGSMD4H2F35C3G?

The 5SGSMD4H2F35C3G positions itself as a high-capacity Stratix® V GS FPGA option for commercial designs that require a large logic fabric, ample embedded RAM, and plentiful I/O in a compact FCBGA package. Its low-voltage core range and RoHS compliance make it suitable for modern, power-aware digital systems within the commercial temperature envelope.

This device is appropriate for engineering teams targeting integration density, on-chip memory resources, and robust I/O capability while leveraging the Stratix V device family characteristics documented in the available datasheet.

Request a quote or submit an inquiry to get pricing, availability, and additional technical details for the 5SGSMD4H2F35C3G.

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