5SGSMD4H2F35I2WN

The 5SGSMD4H2F35I2WN is a Stratix® V GS series Field Programmable Gate Array (FPGA) from Intel, designed for high-density, industrial-grade digital integration. It delivers a large logic fabric alongside substantial embedded RAM and broad I/O counts in a compact surface-mount FCBGA footprint.

This device targets designs that require significant on-chip logic and memory resources while operating across an industrial temperature range and a defined low-voltage supply window, enabling deployment in robust embedded systems and high-density boards.

Key Features

• Core Logic Density  360,000 logic elements for implementing large, complex digital designs and system-level integration.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and DSP data paths without external memory.
• I/O Capacity  432 I/O pins to support wide parallel interfaces, multiple peripherals, and high pin-count system interconnects.
• Package & Mounting  1152-BBGA (FCBGA) supplier package 1152-FBGA (35×35) in a surface-mount format for compact board-level integration.
• Voltage Supply  Operates with a supply range of 870 mV to 930 mV, enabling predictable power domains in low-voltage system designs.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C, suitable for thermally demanding environments.
• Regulatory Compliance  RoHS-compliant to support lead-free manufacturing processes.

Typical Applications

• High-density compute fabrics  Deploy the device where large numbers of logic elements and embedded RAM are required to implement complex algorithms or custom accelerators.
• Industrial control systems  Use the industrial temperature rating and robust I/O count for factory automation, motion control, and equipment monitoring platforms.
• Prototyping and system integration  Leverage the large logic capacity and on-chip memory to consolidate multiple functions into a single FPGA for rapid prototyping and system-level validation.
• High-pin-count interface hub  The 432 I/O pins make this device suitable for boards that need extensive external connectivity or parallel bus implementations.

Unique Advantages

• High logic and memory integration: 360,000 logic elements paired with approximately 19.456 Mbits of embedded RAM reduce dependency on external components and simplify BOM.
• Broad I/O support: 432 I/O pins enable flexible interface options and easy connection to multiple peripherals or high-bandwidth buses.
• Industrial temperature capability: Certified operation from −40 °C to 100 °C provides design margin for demanding environments and extended thermal ranges.
• Compact board-level footprint: 1152-BBGA (35×35) FCBGA package and surface-mount mounting allow high-density PCB layouts and efficient use of board area.
• Controlled low-voltage operation: A defined 870 mV–930 mV supply window helps designers manage power domains and ensure consistent device behavior.
• RoHS compliant: Supports lead-free manufacturing requirements and environmental compliance objectives.

Why Choose 5SGSMD4H2F35I2WN?

The 5SGSMD4H2F35I2WN delivers a balance of high logic capacity, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GS package. Its combination of on-chip resources and a compact 1152-BBGA footprint makes it suitable for engineers consolidating complex system functions onto a single FPGA while operating across a wide temperature range.

This device is well suited to teams building robust embedded systems, prototypes that require large programmable fabrics, or high-pin-count interface modules that benefit from on-die memory and logic density. The Intel Stratix V GS lineage and datasheet-backed electrical characteristics support predictable integration into industrial designs.

Request a quote or submit a product inquiry to receive pricing, availability, and additional technical support information for the 5SGSMD4H2F35I2WN.