5SGSMD4H2F35I3LN

The 5SGSMD4H2F35I3LN is an Intel Stratix® V GS series FPGA supplied in a 1152-BBGA FCBGA package and rated for industrial use. It delivers a high logic capacity and substantial embedded memory with a large I/O complement, suited to complex, resource-intensive programmable logic designs.

Key characteristics include 360,000 logic elements, approximately 19.456 Mbits of on-chip RAM, 432 I/Os, and an industrial operating temperature range, providing a combination of integration density and environmental robustness for demanding applications.

Key Features

• Core logic capacity  360,000 logic elements provide the fabric required for large-scale custom logic and complex system implementations.
• Logic fabric resources  135,840 logic array blocks supporting the device's logic capacity for structured design partitioning.
• Embedded memory  Approximately 19.456 Mbits of on-chip RAM to support buffers, small data stores, and local working memory without immediate dependence on external DRAM.
• I/O resources  432 general-purpose I/Os for dense peripheral and interface connectivity on a single device.
• Package & mounting  1152-BBGA (FCBGA) supplier device package (1152-FBGA, 35×35) in a surface-mount form factor for compact board integration.
• Power  Core voltage supply range of 820 mV to 880 mV for defined power provisioning and budgeting in system designs.
• Temperature & grade  Industrial grade with an operating temperature range from −40 °C to 100 °C for deployment in harsh environments.
• Environmental compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• Industrial automation  Programmable control logic and I/O aggregation in factory and process control systems where industrial temperature operation and high logic density are required.
• High-density I/O systems  Boards and modules that require large numbers of parallel interfaces and signal routing driven by the device's 432 I/O pins.
• Custom accelerators and signal processing  On-chip logic capacity and embedded RAM support implementation of specialized processing pipelines and hardware accelerators.

Unique Advantages

• High integration density: 360,000 logic elements and 135,840 logic array blocks allow consolidation of complex functionality into a single IC, reducing board-level component count.
• Ample on-chip memory: Approximately 19.456 Mbits of embedded RAM helps minimize external memory dependencies for many designs.
• Large I/O complement: 432 I/Os provide flexibility for interfacing with numerous peripherals, sensors, and external logic devices.
• Industrial readiness: Rated for −40 °C to 100 °C operation to meet environmental demands of industrial deployments.
• Compact BGA footprint: 1152-BBGA (35×35) package enables dense PCB integration while maintaining signal routing options.
• Controlled power window: Specified core supply range (820–880 mV) supports consistent power design and verification.

Why Choose 5SGSMD4H2F35I3LN?

The 5SGSMD4H2F35I3LN delivers a combination of large programmable logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package, tailored for industrial-grade applications. Its specified operating temperature range and RoHS compliance make it suitable for designs that require both performance and environmental robustness.

This device is appropriate for engineering teams building high-density, programmable systems where integration, deterministic resource availability, and long-term design scalability are priorities. The device’s defined electrical and environmental parameters support predictable system-level power and thermal planning.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time details for the 5SGSMD4H2F35I3LN. Our team can provide technical and procurement information to support your design and sourcing decisions.