5SGSMD4H3F35C2L

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 1,096 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H3F35C2L – Stratix® V GS FPGA, 360,000 logic elements, 1152-BBGA

The 5SGSMD4H3F35C2L is an Intel Stratix V GS field programmable gate array (FPGA) implemented in a 28‑nm process and optimized for transceiver-driven, DSP‑centric designs. This device combines high logic density, abundant embedded memory and variable‑precision DSP resources with integrated high‑speed transceivers to address data‑intensive applications.

Typical market targets include wireline and communications systems, broadcast and video processing, and high‑performance computing where large logic capacity, on‑chip RAM and flexible DSP performance are required.

Key Features

  • Core Architecture 28‑nm Stratix V architecture with a redesigned adaptive logic module and comprehensive fabric clocking.
  • Logic Capacity 360,000 logic elements for complex, high‑gate‑count implementations.
  • Embedded Memory Approximately 19.5 Mbits of on‑chip RAM implemented in 20 Kbit (M20K) memory blocks for large buffering and data storage.
  • DSP Resources GS‑variant variable precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for intensive signal processing workloads.
  • Integrated Transceivers GS devices offer integrated transceivers with 14.1 Gbps data‑rate capability for backplane and optical interface applications.
  • I/O and Package 432 user I/Os in a surface‑mount 1152‑BBGA (35×35) package providing high pin‑count system connectivity.
  • Power Specified core voltage supply range of 820 mV to 880 mV.
  • Operating Range and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Design Migration Stratix V architecture includes an Embedded HardCopy Block and a documented path to HardCopy V ASICs for volume production transition.
  • Compliance & Mounting RoHS compliant; surface mount device.

Typical Applications

  • Wireline Communications — High‑density logic and integrated transceivers support packet processing, traffic management and backplane interfaces.
  • Broadcast & Video Processing — Large embedded memory and DSP multipliers enable real‑time video processing and format conversion.
  • High‑Performance Computing — Dense logic and variable‑precision DSP resources accelerate compute‑intensive signal and data pipelines.
  • Optical & Backplane Systems — Integrated 14.1 Gbps transceivers provide interface capability for high‑bandwidth optical and backplane links.

Unique Advantages

  • High Logic Density: 360,000 logic elements allow consolidation of complex functions into a single device, reducing board count and system complexity.
  • Substantial On‑Chip Memory: Approximately 19.5 Mbits of embedded RAM implemented as M20K blocks supports deep buffering and large datasets without external memory.
  • DSP‑Centric Architecture: Thousands of variable‑precision DSP multipliers enable efficient implementation of signal processing algorithms and arithmetic‑intensive functions.
  • High‑Speed I/O: 432 I/Os and integrated transceivers suited for high‑bandwidth interfaces and system integration.
  • Production Pathway: Embedded HardCopy Block and documented migration options support prototyping to low‑risk ASIC conversion for volume production.
  • Regulatory & Assembly‑Ready: RoHS compliance and surface‑mount 1152‑BBGA packaging facilitate modern assembly and regulatory requirements.

Why Choose 5SGSMD4H3F35C2L?

The 5SGSMD4H3F35C2L positions itself as a high‑capacity, DSP‑focused Stratix V GS device for designers who need significant logic, on‑chip memory and transceiver capability in a single commercial‑grade FPGA. Its combination of 360,000 logic elements, substantial embedded RAM and variable‑precision DSP multipliers supports demanding, data‑intensive designs while preserving a clear path to HardCopy V ASICs for production scale‑up.

This part is suited to system designers in communications, broadcast, and high‑performance computing who require integrated transceivers, abundant DSP resources and a high pin‑count package for complex I/O routing, all within a commercial temperature range.

Request a quote for 5SGSMD4H3F35C2L to discuss pricing and availability for your next design or production run.

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