5SGSMD4H3F35C2LG

The 5SGSMD4H3F35C2LG is a Stratix® V GS Field Programmable Gate Array (FPGA) from Intel, offered in a commercial temperature grade. This device delivers high logic capacity and on-chip memory in a compact FCBGA package for designs that require substantial programmable logic and dense I/O integration.

With 360,000 logic elements, approximately 19.46 Mbits of embedded RAM, and 432 user I/Os, the device is suited to applications that need large amounts of programmable logic, significant embedded memory, and numerous external interfaces while operating within a commercial temperature range.

Key Features

• Core Logic Capacity  360,000 logic elements (cells) to implement complex programmable logic and custom architectures.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for data buffering, FIFO structures, and on-chip storage.
• I/O Density  432 I/Os to support broad external interfacing and multi-channel connectivity requirements.
• Package and Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type enables standard PCB assembly.
• Power Supply  Core supply voltage range specified at 820 mV to 880 mV.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density logic implementations  Use the device where large programmable logic capacity is required to realize complex state machines, datapaths, or custom processing pipelines.
• Embedded memory–intensive designs  Leverage approximately 19.46 Mbits of on-chip RAM for buffering, packet processing, or multichannel data handling without immediately relying on external memory.
• I/O-rich systems  Deploy in designs that require extensive external interfacing, taking advantage of the 432 available I/O pins for multiple peripherals or parallel channels.

Unique Advantages

• High logic density: 360,000 logic elements provide headroom for large-scale programmable designs, reducing the need to partition logic across multiple devices.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM helps minimize external memory dependence for many buffering and storage use cases.
• Robust I/O complement: 432 I/Os enable flexible interfacing and multi-channel connectivity directly from the device package.
• Compact FCBGA packaging: The 1152-BBGA/1152-FBGA (35×35) package supports high-density board layouts and standard surface-mount assembly.
• Commercial-grade operation: Specified for 0 °C to 85 °C, providing predictable performance for mainstream commercial applications.
• Standards-compliant material status: RoHS compliance supports use in lead-free manufacturing environments.

Why Choose 5SGSMD4H3F35C2LG?

The 5SGSMD4H3F35C2LG offers a balance of high logic capacity, significant embedded memory, and extensive I/O in a compact FCBGA package targeted at commercial applications. Its specification of 360,000 logic elements, approximately 19.46 Mbits of on-chip RAM, and 432 I/Os makes it an appropriate choice for designs that consolidate complex logic and moderate on-chip data storage within a single FPGA device.

As part of the Stratix V GS family from Intel, this device is documented in the Stratix V device datasheet and is suited for teams designing dense programmable solutions that require a well-defined commercial operating window and RoHS-compliant material status.

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