5SGSMD4H2F35I3N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 709 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H2F35I3N – Stratix® V GS Field Programmable Gate Array (FPGA), 360,000 logic elements

The 5SGSMD4H2F35I3N is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA (FCBGA) package. It provides a large programmable fabric with 360,000 logic elements and approximately 19.456 Mbits of embedded RAM for complex, high-density digital designs. Designed and rated as an industrial-grade device, it targets applications that require substantial on-chip logic, memory and I/O capacity within a compact surface-mount package.

Key Features

  • Logic Capacity  360,000 logic elements for large-scale programmable logic implementation.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, caching, and state storage.
  • I/O Resources  432 I/O pins to support extensive peripheral and system-level connectivity.
  • Package & Mounting  1152-BBGA (FBGA, 35×35) package; surface-mount mounting type suitable for compact board designs.
  • Power Supply  Core voltage supply range from 820 mV to 880 mV to match specified device operating conditions.
  • Operating Temperature  Industrial temperature grade with specified operating range of –40 °C to 100 °C.
  • Compliance  RoHS status: Compliant.
  • Family-Level Documentation  Stratix V device datasheet provides electrical and switching characteristics covering operating conditions and power/signal timing for this device family.

Typical Applications

  • High-density programmable logic  Implementation of large-scale custom digital functions leveraging 360,000 logic elements and extensive embedded RAM.
  • Industrial control and automation  Suitable for industrial systems requiring an extended operating temperature range (–40 °C to 100 °C) and robust I/O counts.
  • Data buffering and custom memory architectures  On-chip RAM (approximately 19.456 Mbits) supports buffering, packet memory and state machines within a single device.

Unique Advantages

  • High integration density: 360,000 logic elements reduce the need for multiple devices when implementing complex logic.
  • Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM enables large local storage for performance-sensitive designs.
  • Extensive I/O capability: 432 I/Os provide flexibility for system interfacing, board-level consolidation, and parallel data paths.
  • Industrial-grade operation: Rated for –40 °C to 100 °C operation to meet many industrial environmental requirements.
  • Compact, surface-mount package: 1152-BBGA (35×35 FBGA) package supports dense board layouts while maintaining high pin count.
  • Controlled core supply range: 820 mV–880 mV core voltage range aligns with defined operating conditions from the Stratix V device documentation.

Why Choose 5SGSMD4H2F35I3N?

The 5SGSMD4H2F35I3N delivers a high-capacity Stratix V GS FPGA solution combining 360,000 logic elements, substantial embedded RAM and a high I/O count in a compact 1152-BBGA package. Its industrial temperature rating and defined core voltage range make it suitable for demanding system-level designs that require both density and environmental robustness.

This device is backed by Stratix V family documentation covering electrical and switching characteristics, enabling engineers to align power, timing and signal integrity decisions with the device specifications during system design.

Request a quote or submit a sales inquiry to receive pricing, lead time and availability for the 5SGSMD4H2F35I3N.

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