5SGSMD4H2F35I3WN

The 5SGSMD4H2F35I3WN is an Intel Stratix® V GS field programmable gate array (FPGA) in a 1152‑ball BGA package. It delivers very high logic capacity, substantial on‑chip RAM, and a large I/O count for designs that require dense programmable logic and robust industrial temperature operation.

Targeted at systems that demand high integration and substantial programmable resources, this device supports designs requiring extensive logic, embedded memory, and a high pin count while operating across an industrial temperature range.

Key Features

• Logic Capacity  Contains 360,000 logic elements and 135,840 logic array blocks, providing substantial programmable fabric for complex designs.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM for buffering, state storage, and high‑performance data handling.
• I/O and Packaging  432 device I/O in a 1152‑BBGA (FCBGA) package; supplier package listed as 1152‑FBGA (35×35), optimized for high‑density board designs and surface‑mount assembly.
• Power and Core Voltage  Core voltage supply range specified at 820 mV to 880 mV to define power delivery and system sequencing requirements.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments where extended temperature range is required.
• Compliance  RoHS compliant.
• Stratix V Family Documentation  Part of the Stratix® V family with detailed electrical and switching characteristics documented in the vendor datasheet for design validation and system integration.

Typical Applications

• High‑capacity data processing  Use the large logic count and embedded RAM for packet processing, signal aggregation, and complex algorithm acceleration.
• High‑pin‑count interface hubs  432 I/O enable dense connectivity for multi‑lane interfaces, board‑level routing, and peripheral aggregation.
• Industrial control and automation  Industrial temperature rating (−40 °C to 100 °C) and RoHS compliance make it suitable for factory and process control applications requiring durable operation.
• Complex system integration  Ample logic and memory allow consolidation of multiple functions into a single FPGA to reduce component count and simplify system architectures.

Unique Advantages

• High logic density: 360,000 logic elements deliver capacity for large state machines, pipelines, and parallel processing blocks.
• Substantial embedded memory: Approximately 19.456 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O complement: 432 I/O pins accommodate extensive interfacing without additional I/O expanders.
• Industrial temperature support: Rated from −40 °C to 100 °C for deployment in demanding environments.
• Compact high‑density package: 1152‑BBGA (35×35) package enables dense PCB implementations while maintaining surface‑mount compatibility.
• Vendor documentation: Device characteristics and electrical/switching specifications are provided within the Stratix® V family datasheet for design verification.

Why Choose 5SGSMD4H2F35I3WN?

The 5SGSMD4H2F35I3WN positions itself as a high‑capacity Stratix® V GS FPGA for designs that require significant programmable resources, plentiful I/O, and industrial temperature operation. Its combination of 360,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 432 I/O makes it well suited for system designs that consolidate functions and demand high integration.

Backed by Intel’s Stratix V device documentation, this FPGA supports engineers who need verified electrical and switching characteristics to validate power, timing, and thermal requirements during development and production.

Request a quote or submit an inquiry to obtain pricing, availability, and further technical details for the 5SGSMD4H2F35I3WN.