5SGSMD4H3F35C2LN

The 5SGSMD4H3F35C2LN is an Intel Stratix V GS-series FPGA implemented in a 1152-ball FCBGA package for surface-mount assembly. Built on a 28-nm TSMC process and an enhanced core architecture, this device targets bandwidth- and DSP-centric designs that require high logic density, substantial on-chip memory, and integrated high-speed transceivers.

Typical use cases include bandwidth-centric protocols such as PCIe Gen3, data-intensive networking (40G/100G and beyond), and high-performance digital signal processing where variable-precision DSP resources and integrated transceivers are beneficial.

Key Features

• Core & process  28-nm TSMC process technology with an enhanced Stratix V core architecture.
• Logic capacity  360,000 logic elements to implement large, complex FPGA designs.
• Embedded memory  Approximately 19.456 Mbits of on-chip RAM, organized in 20-Kbit (M20K) embedded memory blocks.
• DSP resources  GS-family devices include abundant variable-precision DSP blocks suitable for high-precision and high-throughput signal processing.
• Transceivers & I/O  Integrated transceivers with 14.1‑Gbps data-rate capability on GS devices and 432 user I/O pins for high-density system interfaces.
• Power  Core supply operating range 820 mV to 880 mV, enabling defined power-domain design and optimization.
• Package & mounting  Supplier device package: 1152-FBGA (35 × 35 mm) — 1152-ball BGA, surface-mount.
• Operating range  Commercial-grade temperature range from 0 °C to 85 °C.
• Design hardening path  Stratix V family devices support a low-risk, low-cost path to HardCopy V ASICs and include Embedded HardCopy Blocks for hardened IP instantiation.
• Compliance  RoHS compliant.

Typical Applications

• High-speed networking  Implement packet processing, traffic management, and 40G/100G transport interfaces using the device’s high logic count, on-chip RAM, and integrated transceivers.
• Bandwidth-centric protocols  Deploy PCI Express Gen3 and similar high-throughput protocols leveraging the Stratix V architecture and hard IP blocks.
• DSP-centric systems  Use variable-precision DSP blocks and abundant memory for digital signal processing tasks in broadcast, high-performance computing, and communication equipment.
• Optical and backplane interfaces  Integrate transceiver-capable links and high I/O counts for backplane or optical transport designs.

Unique Advantages

• High logic and memory integration: 360,000 logic elements and approximately 19.456 Mbits of embedded RAM reduce external memory dependence and simplify system partitioning.
• Built for DSP and transceiver workloads: Variable-precision DSP blocks combined with 14.1‑Gbps transceiver capability make the device well suited for mixed DSP and high-speed I/O designs.
• Defined power domain: A specific core supply range (820 mV–880 mV) supports deterministic power design and thermal budgeting.
• Surface-mount, high-density packaging: 1152-ball FCBGA (35 × 35 mm) provides high I/O density in a compact footprint for space-constrained boards.
• Path to ASIC hardening: Support for HardCopy V ASIC migration and Embedded HardCopy Blocks enables a defined route from FPGA prototype to production ASIC.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.

Why Choose 5SGSMD4H3F35C2LN?

This Stratix V GS FPGA blends substantial logic capacity, dedicated DSP resources, and integrated high-speed transceivers in a single 1152-BBGA package, making it a practical choice for designers targeting bandwidth-intensive and DSP-heavy systems. Its defined core voltage range, large on-chip RAM complement, and support for a HardCopy ASIC migration path provide design stability and scalability from prototyping to higher-volume production.

The 5SGSMD4H3F35C2LN is positioned for engineering teams building networking, communications, and compute platforms that require a balance of logic density, embedded memory, and high-speed I/O in a commercial-temperature FPGA.

Request a quote or contact sales to discuss availability, pricing, and lead time for the 5SGSMD4H3F35C2LN.