5SGSMD4H3F35C2WN

The 5SGSMD4H3F35C2WN is a Stratix® V GS family FPGA from Intel, offered in a 1152-BBGA FCBGA package. This commercial-grade device provides very high core density and significant on-chip memory for designs that require extensive programmable logic and large embedded RAM resources.

Key attributes include 360,000 logic elements, approximately 19.5 Mbits of embedded memory, and 432 general-purpose I/O pins, making the device suitable for complex, I/O-heavy designs that must operate within a commercial temperature range and a low-voltage core supply window.

Key Features

• Core density — 360,000 logic elements to support large-scale programmable logic implementations and complex system integration.
• Embedded memory — Approximately 19.5 Mbits of on-chip RAM suitable for buffering, caching, and memory-intensive algorithms.
• I/O capacity — 432 dedicated I/O pins to accommodate extensive peripheral interfacing and multi-channel connectivity.
• Package & mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount assembly for compact, high-density board designs.
• Power — Core voltage supply range of 870 mV to 930 mV to support the device’s operating requirements.
• Operating environment — Commercial temperature grade rated for 0 °C to 85 °C.
• Compliance — RoHS-compliant product.

Typical Applications

• High-density logic integration — Use where hundreds of thousands of logic elements are required to implement complex custom logic, state machines, or hardware accelerators.
• Memory-intensive processing — Deploy in designs that benefit from multi-megabit on-chip RAM for buffering, packet processing, or data staging.
• Multi-channel I/O systems — Ideal for systems that require a large number of general-purpose I/Os for sensors, interfaces, or parallel data lanes.

Unique Advantages

• High logic capacity: 360,000 logic elements provide headroom for dense logic and integration of multiple subsystems on a single device, reducing BOM complexity.
• Substantial embedded RAM: Approximately 19.5 Mbits of on-chip memory minimizes the need for external memory in many buffering and processing tasks.
• Extensive I/O count: 432 I/O pins enable broad interfacing options and support complex connectivity requirements without immediate reliance on external multiplexing.
• Compact FCBGA package: 1152-ball FCBGA (35×35) delivers a space-efficient footprint for high-density PCB layouts and surface-mount manufacturing.
• Commercial-grade operation: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• RoHS compliant: Aligns with common environmental and regulatory expectations for electronics manufacturing.

Why Choose 5SGSMD4H3F35C2WN?

The 5SGSMD4H3F35C2WN combines very high logic density, multi-megabit embedded memory, and a large I/O complement in a single commercial-grade Stratix V GS FPGA. This combination is well suited to developers and system designers who need to consolidate complex logic, substantial on-chip storage, and wide I/O connectivity into a compact surface-mount package.

As an Intel Stratix V GS device, it offers a balance of integration and scalability for demanding FPGA-based designs where minimizing external components and maximizing on-device resources are priorities.

Request a quote or submit an inquiry for the 5SGSMD4H3F35C2WN to receive pricing and availability information for your design and procurement planning.