5SGSMD4H3F35C3WN

The 5SGSMD4H3F35C3WN is an Intel Stratix® V GS field programmable gate array (FPGA) supplied in a 1152‑FBGA (35×35 mm) footprint. It delivers high on‑chip logic density and embedded memory suitable for complex digital designs requiring extensive logic resources and flexible I/O.

Targeted at commercial applications, this device combines 360,000 logic elements, approximately 19.5 Mbits of embedded RAM, and 432 I/O pins to enable integration of large‑scale functions into a single FPGA while running within a commercial operating temperature range.

Key Features

• High Logic Density — 360,000 logic elements for implementing large, complex logic designs and system integration on a single device.
• Embedded Memory — Approximately 19.5 Mbits of on‑chip RAM to support buffering, LUT‑based storage, and data path requirements without external memory for many use cases.
• Rich I/O Count — 432 user I/O pins to connect to multiple peripherals, buses, and system interfaces directly from the FPGA.
• Core Supply Voltage — Operates with a core voltage supply range of 820 mV to 880 mV consistent with the Stratix V GS family electrical requirements.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial applications.
• Package & Mounting — 1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35), surface mount mounting type for board‑level assembly.
• Standards Compliance — RoHS compliant.

Typical Applications

• High‑density digital systems — Integrate complex control, signal processing, or protocol logic where large logic capacity and on‑chip memory reduce external component count.
• Communications equipment — Implement packet processing, protocol engines, or interface bridging using the device’s high logic and I/O resources.
• Prototyping and system integration — Consolidate multiple functions into a single FPGA for rapid prototyping and reducing board‑level complexity.

Unique Advantages

• Large single‑chip capacity: 360,000 logic elements enable integration of multiple subsystems without partitioning across several devices, simplifying board design and BOM.
• Significant embedded RAM: Approximately 19.5 Mbits of on‑chip memory supports data buffering and local storage needs that improve system determinism and reduce external memory dependency.
• Extensive I/O connectivity: 432 I/Os allow flexible interfacing to peripheral devices, high‑pin-count buses, and multi‑lane systems directly from the FPGA.
• Commercial‑grade suitability: Specified for 0 °C to 85 °C operation, aligning with a wide range of commercial deployment environments.
• Industry supplier: Manufactured by Intel and aligned with Stratix V family documentation for electrical and switching characteristics.
• RoHS compliance: Meets current RoHS requirements for environmental and regulatory conformity.

Why Choose 5SGSMD4H3F35C3WN?

The 5SGSMD4H3F35C3WN positions itself as a high‑capacity, commercially rated FPGA option for designers who need substantial logic resources, on‑chip memory, and a high I/O count in a single 1152‑FBGA package. Its combination of 360,000 logic elements, approximately 19.5 Mbits of embedded RAM, and 432 I/Os provides the building blocks to consolidate complex digital functions and streamline system architectures.

This device is well suited for customers developing high‑density digital designs and communications systems who require a commercially rated FPGA backed by Intel’s Stratix V family documentation for electrical and switching characteristics. The package, supply voltage range, and RoHS compliance support mainstream production and assembly workflows.

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