5SGSMD4H3F35I3G

The 5SGSMD4H3F35I3G is a Stratix V GS field programmable gate array (FPGA) IC optimized for designs that require large programmable logic capacity and substantial on-chip memory. It integrates 360,000 logic elements with approximately 19.456 Mbits of embedded RAM and supports up to 432 I/O pins in a high-density 1152-BBGA (35×35) package.

Built and specified for industrial temperature operation, this device is suited to applications that demand significant integration of logic, memory, and I/O while operating across a wide voltage and temperature range.

Key Features

• Core Logic  360,000 logic elements providing large programmable logic capacity for complex designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffers, FIFOs, and local data storage.
• I/O Density  432 user I/O pins for broad connectivity to external peripherals, memory, and interfaces.
• Power and Supply  Core supply range specified between 820 mV and 880 mV to match system power-rail planning.
• Package & Mounting  1152-BBGA (FCBGA) supplier package (1152-FBGA, 35×35) optimized for surface-mount assembly.
• Temperature Grade  Industrial grade operation across −40 °C to 100 °C for deployment in harsher environments.
• Standards Compliance  RoHS compliant for material and environmental considerations.

Typical Applications

• High-density signal processing  Use the large logic capacity and on-chip RAM to implement complex DSP pipelines and data buffering close to the FPGA fabric.
• Communications and networking equipment  High I/O count and significant logic resources make the device suitable for packet processing, protocol handling, and custom interface logic.
• Industrial control and automation  Industrial temperature rating and robust packaging support deployment in factory automation, motion control, and instrumentation systems.
• Embedded compute platforms  Combine logic density and memory to accelerate custom compute kernels and offload tasks from host processors.

Unique Advantages

• Substantial logic capacity: 360,000 logic elements enable large, complex designs without immediate need for multiple devices.
• Integrated memory footprint: Approximately 19.456 Mbits of embedded RAM reduces external memory dependency for many buffering and state-storage needs.
• High I/O count: 432 I/Os simplify board-level routing by allowing numerous external connections directly to the FPGA.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation in demanding environmental conditions.
• Compact, surface-mount packaging: 1152-BBGA (35×35) FCBGA packaging balances high pin count with a compact footprint for dense system designs.
• Regulatory compliance: RoHS compliance supports environmentally conscious product development and procurement.

Why Choose 5SGSMD4H3F35I3G?

The 5SGSMD4H3F35I3G delivers a combination of extensive programmable logic, on-chip memory, and a high I/O count within an industrial-temperature, surface-mount package. These characteristics make it a practical choice for engineers designing systems that require significant integration of custom logic and data handling while maintaining footprint efficiency and environmental robustness.

This Stratix V GS device is appropriate for development teams and product designers focused on advanced signal processing, communications, industrial controls, and embedded compute applications that benefit from scalable FPGA resources and established device family documentation.

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