5SGSMD4H3F35I3LN

The 5SGSMD4H3F35I3LN is a Stratix V GS family field programmable gate array (FPGA) offered in an industrial temperature grade. This device integrates a high density of programmable logic, on-chip memory, and a large I/O count in a 1152-ball FCBGA package suitable for surface-mount assembly.

Engineered for designs that require significant logic capacity and embedded memory while operating across an extended temperature range, this Stratix V GS part is targeted at applications that benefit from high integration and robust operating conditions.

Key Features

• Logic Capacity  360,000 logic elements (cells) provide substantial programmable logic resources for complex digital functions and custom acceleration.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory for many use cases.
• I/O Density  432 general-purpose I/Os enable broad interfacing and high pin-count system integration.
• Device Family  Stratix V GS series device—electrical and switching characteristics follow the Stratix V device specifications for core, periphery, and I/O timing.
• Power Supply  Core voltage range specified at 820 mV to 880 mV to match platform power-rail requirements.
• Package & Mounting  Supplier device package: 1152-FBGA (35×35 mm), listed as 1152-BBGA, FCBGA; surface-mountable for modern PCB assembly.
• Industrial Temperature Grade  Operating temperature range of −40 °C to 100 °C for deployment in environments requiring extended ambient capability.
• RoHS Compliant  Device meets RoHS environmental compliance requirements.

Typical Applications

• Industrial Control and Automation  Extended operating temperature and high logic density support control algorithms, I/O aggregation, and local processing in industrial systems.
• High-Density Digital Processing  Large number of logic elements and substantial embedded memory enable implementation of complex signal processing and custom compute pipelines.
• Interface Bridging and Aggregation  High I/O count makes the device suitable for consolidating multiple interfaces or implementing protocol bridging within a compact package.

Unique Advantages

• High Logic and Memory Integration: Combines 360,000 logic elements with approximately 19.456 Mbits of on-chip RAM to reduce reliance on external memory and simplify board-level design.
• Large I/O Capability: 432 I/Os allow flexible interfacing and dense connectivity for complex systems without needing multiple companion devices.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C operation, enabling deployment in temperature-challenging environments.
• Compact, Assembly-Ready Package: 1152-ball FCBGA (35×35) package supports surface-mount assembly practices for modern production workflows.
• Controlled Core Voltage Range: Specified core supply between 820 mV and 880 mV for predictable power planning and thermal management.
• Standards-Based Device Family: Part of the Stratix V family with documented electrical and switching characteristics for integration and system-level timing analysis.

Why Choose 5SGSMD4H3F35I3LN?

The 5SGSMD4H3F35I3LN delivers a balanced combination of high logic capacity, substantial embedded RAM, and a large I/O complement in an industrial-grade Stratix V GS device. Its package and power specifications support compact, surface-mount system designs that require reliable operation across a wide temperature range.

This device is well suited to engineers and system designers building high-density digital processing, I/O-rich interface modules, or industrial control equipment where integration, predictable electrical characteristics, and extended temperature performance are priorities.

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