5SGSMD4H3F35I4G

The 5SGSMD4H3F35I4G is a Stratix® V GS family field programmable gate array (FPGA) in an FCBGA package, designed to deliver substantial programmable logic, on‑chip memory, and I/O capacity. It targets designs that require large logic capacity, abundant I/O, and significant embedded memory within a compact surface-mount BGA footprint.

Key Features

• Core Logic  360,000 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support large data buffers, FIFOs, and block memory requirements.
• I/O Density  432 I/O pins to support extensive connectivity to peripherals, memory interfaces, and board-level interconnects.
• Package & Mounting  1152‑BBGA FCBGA package (supplier device package: 1152‑FBGA, 35×35 mm) optimized for surface-mount assembly.
• Power Supply  Core voltage supply specified between 820 mV and 880 mV.
• Temperature Grade  Industrial temperature rating with an operating range of -40 °C to 100 °C for deployment in temperature‑challenging environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial systems  Use where industrial temperature operation (-40 °C to 100 °C) and large programmable logic are required.
• High‑density digital designs  Suitable for designs that require hundreds of thousands of logic elements and substantial embedded RAM.
• I/O‑intensive interfaces  Ideal for boards needing many external connections—432 I/Os provide flexibility for complex peripheral and bus interfaces.
• Compact, high‑integration products  The 1152‑BBGA FCBGA package supports compact system-level integration with surface-mount assembly.

Unique Advantages

• Large logic capacity: 360,000 logic elements enable implementation of extensive custom logic and parallel processing architectures.
• Substantial embedded memory: Approximately 19.46 Mbits of on‑chip RAM reduces external memory reliance for many buffer and storage needs.
• High I/O count: 432 I/Os provide design flexibility for multiple interfaces, sensors, and peripheral systems.
• Industrial temperature rating: Rated from -40 °C to 100 °C for reliable operation in demanding thermal environments.
• Compact FCBGA package: 1152‑BBGA (supplier 1152‑FBGA, 35×35 mm) supports high pin density while maintaining a surface-mount form factor.
• Low‑voltage core: Core supply between 820 mV and 880 mV for compatibility with low‑voltage power domains.

Why Choose 5SGSMD4H3F35I4G?

The 5SGSMD4H3F35I4G positions itself as a high‑capacity Stratix V GS FPGA option for designs that need extensive programmable logic, generous embedded memory, and a large I/O complement in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for temperature‑sensitive deployments where long-term reliability matters.

Engineers and procurement teams selecting this device benefit from a proven Stratix V device family platform with detailed electrical and switching characteristics documented by the manufacturer, enabling informed integration into complex systems.

Request a quote or submit a procurement inquiry to receive pricing, availability, and additional ordering information for the 5SGSMD4H3F35I4G.