5SGSMD4H3F35I4WN

The 5SGSMD4H3F35I4WN is an Intel Stratix V GS Field Programmable Gate Array (FPGA) offered in an industrial-grade device. It provides a high logic capacity with 360,000 logic elements and approximately 19.456 Mbits of on-chip RAM, enabling dense, memory-rich FPGA implementations.

Packaged in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package, the device exposes 432 I/O pins and operates from a core supply range of 820 mV to 880 mV with an operating temperature range of –40 °C to 100 °C, addressing demanding industrial temperature and integration requirements.

Key Features

• Logic Capacity  360,000 logic elements provide substantial resources for large-scale digital designs and complex logic integration.
• Embedded Memory  Approximately 19.456 Mbits of total on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O and Package  432 user I/O pins in a 1152-BBGA (supplier package: 1152-FBGA, 35×35) FCBGA package with surface-mount mounting for compact system integration.
• Power  Core voltage supply range from 820 mV to 880 mV for compatibility with low-voltage power architectures.
• Temperature and Grade  Industrial-grade qualification with an operating temperature range of –40 °C to 100 °C for use in temperature-demanding environments.
• Device Density Reference  Large on-chip resource set suitable for consolidating logic, memory, and I/O in a single FPGA device.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Signal processing and compute acceleration  Use the 360,000 logic elements and ~19.456 Mbits of embedded memory to implement complex DSP pipelines and buffering on-chip.
• High-density I/O systems  432 I/O pins support designs that require many external interfaces, parallel data paths, or multi-channel connectivity.
• Industrial control and automation  Industrial-grade operation and a –40 °C to 100 °C temperature range enable deployment in industrial control, motor drives, and factory automation systems.
• Memory-intensive logic implementations  On-chip RAM capacity supports stateful logic, packet buffering, and application-specific memory architectures within the FPGA fabric.

Unique Advantages

• High logic density:  360,000 logic elements allow consolidation of large, discrete logic functions into a single device, reducing external components.
• Substantial embedded memory:  Approximately 19.456 Mbits of on-chip RAM lowers dependence on external memory for many buffering and stateful tasks.
• Extensive I/O capability:  432 I/O pins provide flexibility for multi-channel interfaces, parallel buses, and complex connectivity requirements.
• Industrial operating range:  Rated for –40 °C to 100 °C operation, the device meets temperature demands common in industrial environments.
• Compact FCBGA package:  1152-BBGA (35×35) surface-mount packaging balances high pin count with a compact footprint for board-level integration.
• Low-voltage core operation:  820 mV to 880 mV core supply supports integration with modern low-voltage power domains.

Why Choose 5SGSMD4H3F35I4WN?

The 5SGSMD4H3F35I4WN positions itself as a high-density, industrial-grade Stratix V GS FPGA suited to designs that require large logic capacity, significant on-chip memory, and substantial I/O. Its combination of 360,000 logic elements, approximately 19.456 Mbits of RAM, 432 I/O, and a compact 1152-BBGA package supports consolidation of complex functions and interfaces into a single device.

Manufactured by Intel and supported by device documentation, this part is appropriate for engineering teams seeking an FPGA with robust on-chip resources and industrial temperature capability for long-term deployment in board-level systems.

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