5SGSMD4H3F35I3WN

The 5SGSMD4H3F35I3WN is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) IC in an industrial-grade package. It provides high-density programmable logic, abundant on‑chip memory, and a large I/O count for complex digital designs.

With 360,000 logic elements, approximately 19.456 Mbits of embedded memory, and 432 user I/Os, this device targets applications that require high integration density, deterministic operating conditions, and industrial temperature capability (‑40 °C to 100 °C).

Key Features

• Core Logic  360,000 logic elements and 135,840 logic array blocks provide significant capacity for complex logic implementations and custom hardware acceleration.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support large buffers, FIFOs, and state storage without external memory for many functions.
• I/O Density  432 user I/Os enable extensive external interfacing for high‑pin‑count designs and dense board-level integration.
• Power and Voltage  Core supply range specified at 820 mV to 880 mV to support the device’s power architecture and enable defined power delivery design.
• Package & Mounting  1152‑ball BGA (FCBGA) in a 35 × 35 mm supplier device package (1152‑FBGA) for compact, high‑density PCB implementations; surface‑mount mounting type.
• Temperature & Grade  Industrial grade device rated for operation from ‑40 °C to 100 °C for deployment in demanding environmental conditions.
• Regulatory  RoHS compliant to align with current material and environmental requirements.

Typical Applications

• High‑density digital systems  Implement complex state machines, datapaths, and custom logic that require up to 360,000 logic elements and extensive on‑chip RAM.
• Interface aggregation  Consolidate multiple interfaces and peripherals using 432 I/Os to reduce board complexity and external glue logic.
• Industrial embedded systems  Deploy in industrial environments where the device’s ‑40 °C to 100 °C operating range and industrial grade are required.

Unique Advantages

• High integration density: The combination of 360,000 logic elements and substantial embedded memory reduces reliance on external components and simplifies system architecture.
• Large I/O complement: 432 user I/Os allow direct connection to numerous peripherals and subsystems, minimizing intermediate interface hardware.
• Industrial temperature capability: Rated to operate from ‑40 °C to 100 °C, supporting robust designs for demanding environments.
• Compact packaging: 1152‑BBGA (35 × 35) FCBGA package enables dense board layouts while keeping the device surface‑mount compatible.
• Controlled core voltage: Defined supply range (820 mV–880 mV) helps designers plan power distribution and thermal budgets accurately.
• RoHS compliant: Aligns with material compliance requirements for modern electronic assemblies.

Why Choose 5SGSMD4H3F35I3WN?

The 5SGSMD4H3F35I3WN positions itself as a high‑capacity Stratix V GS FPGA option for engineers needing substantial programmable logic, on‑chip memory, and a broad I/O set in an industrial‑rated device. Its combination of logic density, memory resources, and packaging density supports designs that require consolidation of functions and predictable operation across a wide temperature range.

Choose this FPGA when your design demands scalable logic resources, significant embedded RAM, and a high number of external interfaces while retaining industrial operating margins and RoHS compliance.

Request a quote or submit a product inquiry to obtain availability, pricing, and lead‑time details for the 5SGSMD4H3F35I3WN.