5SGSMD4H3F35I3L

The 5SGSMD4H3F35I3L is a Stratix V GS Field Programmable Gate Array (FPGA) from Intel, supplied in a 1152‑ball BGA FCBGA package. It delivers large on‑chip logic and memory capacity combined with a wide I/O count for complex, programmable system designs.

Designed and rated for industrial use, this device targets applications that require substantial embedded memory, extensive I/O, and operation across an extended temperature range.

Key Features

• Logic Capacity — 360,000 logic elements for implementing large, complex logic functions and parallel processing blocks.
• Embedded Memory — Approximately 19.456 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage without external memory for many functions.
• I/O Resources — 432 user I/O pins to interface with high‑pin‑count peripherals and multi‑lane systems.
• Power Supply — Core voltage range specified at 820 mV to 880 mV for the device core power rail.
• Package & Mounting — 1152‑BBGA, FCBGA (supplier package 1152‑FBGA, 35×35) in a surface‑mount form factor suitable for dense PCB integration.
• Temperature & Grade — Industrial grade with specified operating range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Network & Communications — Use the device’s large logic and memory capacity alongside 432 I/Os for packet processing, protocol bridging, and interface aggregation.
• Data Processing & Acceleration — Implement custom datapaths and parallel processing kernels leveraging 360,000 logic elements and on‑chip RAM for low‑latency buffering.
• Industrial Control — Deploy in control systems that require industrial temperature operation (−40 °C to 100 °C) and robust programmable logic.
• High‑density I/O Systems — Ideal for systems requiring many external interfaces or multiport connectivity thanks to the 432 available I/Os.

Unique Advantages

• High logic density: 360,000 logic elements allow consolidation of multiple functions onto a single FPGA, reducing system complexity.
• Substantial embedded memory: Approximately 19.456 Mbits of on‑chip RAM supports local data storage and buffering without immediate dependence on external memory.
• Extensive I/O capability: 432 I/Os enable flexible connectivity to multiple subsystems and parallel data lanes.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for deployment in demanding environments.
• Compact board footprint: 1152‑BBGA (35×35) surface‑mount package provides high integration in dense PCB designs.
• Regulatory readiness: RoHS compliance supports environmentally conscious design and supply chain requirements.

Why Choose 5SGSMD4H3F35I3L?

The 5SGSMD4H3F35I3L positions itself as a high‑density, industrial‑grade Stratix V GS FPGA suited to designs that need a combination of large logic capacity, significant on‑chip memory, and a high I/O count. Its specified core voltage window and surface‑mount 1152‑BBGA package make it practical for integrated, production‑oriented PCB implementations.

This device is appropriate for engineering teams building complex communication, data processing, or industrial control systems that require scalable logic resources, ample embedded RAM, and operation across an extended temperature range.

Request a quote or submit a request to evaluate 5SGSMD4H3F35I3L for your next design.