5SGSMD4H3F35C4G

The 5SGSMD4H3F35C4G is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable fabric with a large logic element count, substantial on-chip RAM, and a high I/O count in a compact 1152-FBGA (35×35) package.

Designed for commercial-grade systems, this device targets complex digital designs that require abundant logic resources, on-chip memory, and broad I/O connectivity while operating within a low-voltage core supply range.

Key Features

• High-density logic  360,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• On-chip memory  Approximately 19.456 Mbits of embedded RAM to support buffering, packet memory, and on-chip data storage.
• I/O capacity  432 general-purpose I/Os for diverse interfacing and high pin-count connectivity.
• Package and mounting  1152-BBGA / 1152-FBGA (35×35) package in a surface-mount form factor for dense board-level integration.
• Power and supply  Core voltage supply range: 820 mV to 880 mV to match low-voltage system designs.
• Operating conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS-compliant device, suitable for lead-free assembly processes.

Typical Applications

• High-performance digital processing  Large logic capacity and embedded RAM make this device suitable for compute-heavy FPGA functions such as signal processing and algorithm acceleration.
• Data plane and packet processing  High I/O count and ample on-chip memory support networking and switching logic that require multiple interfaces and buffering.
• Interface bridging and protocol aggregation  Use the abundant I/Os to consolidate and translate between multiple peripheral and bus standards within a single FPGA device.
• Prototyping and system integration  Commercial-grade performance and a compact FBGA package enable rapid integration into evaluation platforms and production prototypes.

Unique Advantages

• Massive programmable fabric: 360,000 logic elements provide headroom for complex, multi-function designs without external ASICs.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-machine tasks.
• Broad connectivity: 432 I/Os allow dense peripheral and high-pin-count interfacing for systems requiring many external connections.
• Compact, industry-standard package: 1152-FBGA (35×35) delivers a balance of package density and board-level routing efficiency.
• Low-voltage core support: 820 mV to 880 mV supply range aligns with power-optimized system designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C for mainstream commercial applications and environments.

Why Choose 5SGSMD4H3F35C4G?

The 5SGSMD4H3F35C4G positions itself as a high-density Stratix V GS FPGA option where large logic capacity, substantial on-chip memory, and extensive I/O are required in a compact surface-mount FBGA package. Its specifications make it appropriate for commercial designs that need to consolidate complex functions into a single programmable device while maintaining low-voltage core operation.

Engineers and system designers looking to implement advanced digital processing, protocol bridging, or high-channel-count I/O systems will find the device’s resource mix and form factor well-suited to prototyping and production deployments supported by Intel’s Stratix V documentation.

Request a quote or submit a procurement inquiry to get pricing, availability, and technical support information for the 5SGSMD4H3F35C4G.