5SGSMD4H3F35C4WN

The 5SGSMD4H3F35C4WN is an Intel Stratix® V GS field‑programmable gate array (FPGA) delivered in a 1152‑BBGA (35×35) FCBGA package. This commercial‑grade device provides high logic capacity and substantial on‑chip memory, making it suitable for complex digital designs that require dense programmable logic, significant embedded RAM, and a large I/O count.

Key measured characteristics include 360,000 logic elements, approximately 19.456 Mbits of embedded memory, 432 user I/Os, a core supply window of 820 mV to 880 mV, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  360,000 logic elements for implementing large, complex logic designs and programmable datapaths.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, lookup tables, and intermediate storage without external memory for many use cases.
• High I/O Count  432 user I/Os to accommodate dense board‑level connectivity and multiple parallel interfaces.
• Power Supply  Core voltage supply specified between 820 mV and 880 mV for the device core.
• Package & Mounting  Surface‑mount 1152‑BBGA (FCBGA) package, supplier package listed as 1152‑FBGA (35×35), optimized for compact, high‑density board designs.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for lead‑free assembly and environmental compliance.

Typical Applications

• High‑density digital processing  Designs that require large logic capacity and significant on‑chip memory can leverage the 360,000 logic elements and approximately 19.456 Mbits of embedded RAM.
• Multi‑I/O systems  Applications needing many parallel interfaces or extensive board interconnects benefit from the device’s 432 user I/Os.
• Compact board implementations  The 1152‑BBGA surface‑mount package supports high logic integration in space‑constrained PCBs.

Unique Advantages

• High logic density: 360,000 logic elements enable large, integrated designs and reduce the need for multiple devices.
• Substantial embedded memory: Approximately 19.456 Mbits of on‑chip RAM supports data buffering and state storage without immediate external memory dependence.
• Large I/O availability: 432 I/Os provide flexibility for parallel interfaces, control signals, and board‑level connectivity.
• Compact, manufacturable package: 1152‑BBGA (35×35) surface‑mount package offers a balance of lead‑free assembly compatibility and high pin‑count routing density.
• Commercial operating range: Rated for 0 °C to 85 °C for deployments in standard commercial environments.
• RoHS compliance: Meets environmental and lead‑free requirements for modern PCB assembly.

Why Choose 5SGSMD4H3F35C4WN?

The 5SGSMD4H3F35C4WN positions itself as a high‑capacity, commercially graded FPGA option within the Stratix V GS family, combining large logic and memory resources with a high I/O count in a compact FCBGA footprint. Its electrical characteristics—core supply range and operating temperature—are specified to support reliable integration into commercial systems.

This device is appropriate for engineering teams and procurement seeking a single‑device solution for complex, high‑density programmable logic tasks where on‑chip RAM and abundant I/O are key considerations. Documentation for the Stratix V family provides the electrical and switching characteristics needed for detailed system design and qualification.

Request a quote or submit a pricing and availability inquiry to evaluate 5SGSMD4H3F35C4WN for your next design. Include your quantity and required delivery timeframe for a tailored response.