5SGSMD4H3F35I3LG

The 5SGSMD4H3F35I3LG is a Stratix® V GS field programmable gate array (FPGA) IC offering a high-density, programmable logic fabric optimized for industrial applications. It delivers a large logic capacity and significant on-chip memory in a surface-mount 1152-BBGA (35×35) package.

Designed for systems that require extensive I/O, substantial embedded RAM, and extended operating temperature range, this device suits industrial designs where integration, predictable power rails, and robust thermal performance are key considerations.

Key Features

• Core Capacity  360,000 logic elements provide ample programmable logic resources for complex custom digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, temporary storage, and memory-hungry algorithms without external memory for many use cases.
• I/O  432 user I/O pins enable high-pin-count connectivity for interfacing with peripherals, sensors, and external subsystems.
• Power  Core voltage range specified at 820 mV to 880 mV to match low-voltage system rails and enable predictable power planning.
• Package & Mounting  1152-BBGA, FCBGA supply package (supplier device package: 1152-FBGA, 35×35); surface-mount mounting simplifies board-level integration in compact layouts.
• Operating Range  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control & Automation  Extended temperature rating and high logic density make the device suited for programmable control, motion control, and PLC-like applications.
• High‑Density Digital Processing  Large logic and embedded RAM capacity support signal processing, packet parsing, and custom accelerator functions.
• Networking & Connectivity Platforms  High I/O count enables extensive interfacing for switch fabric, I/O aggregation, and front‑end communication modules.
• System Integration & Prototyping  Compact 1152‑FBGA package and surface-mount mounting facilitate integration into evaluation and production boards where board area and I/O routing are critical.

Unique Advantages

• High logical integration: The combination of 360,000 logic elements and ~19.456 Mbits of embedded RAM reduces the need for external logic and memory, simplifying bills of materials.
• Robust industrial operation: Rated for −40 °C to 100 °C, enabling deployment in harsher thermal environments without derating design requirements.
• Predictable low‑voltage core: Specified 820 mV–880 mV supply window assists designers targeting low-voltage power architectures.
• Large I/O capacity: 432 I/O pins provide the connectivity density required for multi-channel and multi-peripheral systems.
• Compact, manufacturable package: 1152‑BBGA (35×35) surface-mount package supports high-density board layouts and automated assembly processes.
• RoHS compliance: Environmentally compliant for modern manufacturing and regulatory requirements.

Why Choose 5SGSMD4H3F35I3LG?

The 5SGSMD4H3F35I3LG combines substantial logic capacity, meaningful on‑chip memory, and a high pin-count package in an industrial-grade Stratix® V GS device. Its specification set supports designs that require dense custom logic, extensive I/O, and operation across a wide temperature range.

As part of the Stratix V family, the device is provided with documented electrical and switching characteristics to support design verification and system integration, offering a platform for scalable, robust FPGA-based solutions.

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