5SGSMD4H3F35C3G

The 5SGSMD4H3F35C3G is a Stratix V GS family FPGA manufactured by Intel, delivered in a 1152-ball BGA (FCBGA) package. This device integrates a high-density programmable fabric and on-chip memory to support complex, logic- and memory-intensive designs.

With 360,000 logic elements, approximately 19.46 Mbits of embedded memory and 432 I/O pins, this commercial-grade FPGA is suited for designs that require large-scale programmable logic, substantial embedded RAM, and a high I/O count while operating within a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  360,000 logic elements to implement large custom digital designs.
• Embedded Memory  Total on-chip RAM of 19,456,000 bits (approximately 19.46 Mbits) for datapath buffering, state storage, and lookup tables.
• I/O Density  432 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power  Core voltage supply range of 820 mV to 880 mV, enabling defined power delivery planning for the programmable core.
• Package & Mounting  1152-ball BGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for standard PCB assembly flows.
• Operating Range & Grade  Commercial temperature grade rated for operation from 0 °C to 85 °C.
• Compliance  RoHS-compliant to support modern electronics manufacturing and environmental requirements.
• Family Documentation  Part of the Stratix V device family; datasheet coverage includes electrical characteristics, switching and I/O timing, and transceiver options for Stratix V GS devices.

Typical Applications

• High-capacity logic implementations  Large custom accelerators and protocol engines that require extensive programmable logic and embedded memory.
• Memory-intensive data paths  Buffering, packet processing, and on-chip storage functions leveraging approximately 19.46 Mbits of RAM.
• I/O-rich interface bridging  Designs that need a high number of I/Os for parallel interfaces, sensor arrays, or multi-lane connectivity.
• Transceiver-based systems  Applications that rely on the Stratix V GS family’s transceiver capabilities as documented in the Stratix V device datasheet.

Unique Advantages

• High-density programmable fabric: 360,000 logic elements provide headroom for complex finite state machines, compute blocks, and custom datapath logic.
• Substantial on-chip RAM: Approximately 19.46 Mbits of embedded memory reduces the need for external buffering and simplifies board-level memory design.
• Large I/O complement: 432 I/O pins enable broad interfacing options without additional I/O expanders.
• Defined power window: Known core voltage range (820 mV–880 mV) facilitates predictable power-supply design and thermal planning.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation to match standard commercial product deployment.
• RoHS-compliant: Meets environmental manufacturing requirements for modern electronics production.

Why Choose 5SGSMD4H3F35C3G?

The 5SGSMD4H3F35C3G combines a high count of logic elements, substantial embedded RAM, and a large I/O complement in a compact 1152-ball BGA package, making it suitable for demanding programmable-logic applications that require integration and density. Its defined core voltage range and commercial temperature rating enable predictable power and thermal design for mainstream electronic products.

This device is appropriate for engineering teams building complex digital systems that need scalable programmable logic and on-chip memory while leveraging the Stratix V family documentation for integration and system-level planning.

Request a quote or submit a procurement inquiry to evaluate how the 5SGSMD4H3F35C3G can meet your design requirements. Technical datasheet documentation is available to support detailed integration and qualification activities.