5SGSMD4H3F35C2N

The 5SGSMD4H3F35C2N is a Stratix® V GS field programmable gate array (FPGA) optimized for transceiver‑based, DSP‑centric applications. Built on the Stratix V architecture, this device delivers high logic capacity with 360,000 logic elements, approximately 19.5 Mbits of embedded memory, and extensive I/O in a 1152‑BBGA package.

This commercial‑grade FPGA targets bandwidth‑ and compute‑intensive markets such as wireline communications, broadcast, military communications, and high‑performance computing where integrated transceivers and variable‑precision DSP capability are required.

Key Features

• Logic Capacity — 360,000 logic elements to implement complex digital logic and system functions.
• Embedded Memory — Approximately 19.5 Mbits of on‑chip RAM using M20K memory blocks for high‑throughput buffering and storage.
• Variable‑Precision DSP Blocks — Stratix V GS family supports abundant DSP resources, including up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision signal processing.
• Integrated Transceivers — GS devices include integrated transceiver capability with up to 14.1 Gbps data rates for backplane and optical interfaces.
• Hard IP and ASIC Path — Includes Embedded HardCopy Block capability for hardened PCIe IP (Gen1/Gen2/Gen3) and a defined path to HardCopy V ASICs for higher volume production.
• Package and I/O — 1152‑BBGA (FCBGA) 35×35 supplier package with 432 I/O for dense board integration and high pin‑count designs. Surface‑mount mounting type.
• Power and Supply — Core supply range specified at 870 mV to 930 mV for the device core.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation; RoHS compliant.

Typical Applications

• High‑Performance DSP Systems — Implement complex filtering, FFTs, and custom arithmetic using the device’s variable‑precision DSP multipliers and large on‑chip memory.
• Optical and Backplane Communications — Use integrated transceivers (up to 14.1 Gbps in GS devices) to support high‑speed serial links and packet transport systems.
• Data Center and Networking — Deploy for 40G/100G aggregation, packet processing, and traffic management where high logic capacity and embedded memory are required.
• Military and Broadcast Equipment — Leverage DSP resources and transceiver interfaces for signal processing, modulation/demodulation, and high‑bandwidth I/O in professional systems.

Unique Advantages

• High Logic Density: 360,000 logic elements enable complex SoC‑level implementations without external logic expansion.
• Substantial On‑Chip Memory: Approximately 19.5 Mbits of embedded RAM reduce external memory bandwidth requirements and simplify board design.
• Rich DSP Resource Set: Hundreds to thousands of dedicated multipliers allow high‑precision, high‑throughput signal processing pipelines.
• Integrated High‑Speed I/O: 432 I/O pins and integrated transceivers support dense, high‑bandwidth system interfaces on a single device.
• Production Path to ASIC: Embedded HardCopy capability and a defined migration path to HardCopy V ASICs help lower risk when moving from prototype to production volumes.
• Standard Commercial Grade and Compliance: Designed for 0 °C to 85 °C operation and RoHS compliant for mainstream system deployments.

Why Choose 5SGSMD4H3F35C2N?

The 5SGSMD4H3F35C2N combines large logic capacity, substantial embedded memory, abundant DSP multipliers, and integrated transceiver capability in a high‑pin‑count 1152‑BBGA package. It is well suited to engineers designing high‑bandwidth, DSP‑intensive systems who need on‑chip resources to minimize external components and simplify board layout.

With Stratix V family features such as M20K memory blocks, adaptive logic modules, Embedded HardCopy blocks, and a production migration path, this device supports both advanced prototyping and a low‑risk route to higher‑volume ASIC production.

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