5SGSMD4H3F35C2G

The 5SGSMD4H3F35C2G is a Stratix V GS series field‑programmable gate array (FPGA) offered by Intel. This high‑density programmable logic device provides a large fabric of logic elements, substantial on‑chip RAM, and extensive I/O in an FCBGA package for surface‑mount assembly.

With 360,000 logic elements and approximately 19.46 Mbits of embedded memory, this device is tailored for designs that require significant logic capacity, abundant embedded storage, and up to 432 I/O pins, while operating within a commercial temperature range.

Key Features

• Core Logic 360,000 logic elements (cells) delivering large programmable‑logic capacity for complex designs.
• Embedded Memory Approximately 19.46 Mbits of on‑chip RAM for buffering, FIFOs, and implemented memory structures.
• I/O Resources Up to 432 user I/O pins to support wide parallel interfaces and multiple external connections.
• Package & Mounting Supplied in a 1152‑BBGA (1152‑FBGA, 35×35) FCBGA package for surface‑mount PCB assembly.
• Power Core supply range specified at 870 mV to 930 mV for the device core rail.
• Operating Grade & Temperature Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance RoHS‑compliant status for environmental conformity.

Typical Applications

• High‑capacity programmable logic systems — Designs that require large numbers of logic elements and substantial on‑chip RAM can benefit from the device’s 360,000 logic elements and ~19.46 Mbits of embedded memory.
• Systems needing extensive I/O — Up to 432 I/O pins support wide parallel interfaces and multiple peripheral connections on a single FPGA.
• Compact, surface‑mount FPGA implementations — The 1152‑FBGA (35×35) package provides a high‑density package option for space‑constrained PCBs.

Unique Advantages

• High logic density: 360,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Integrated embedded memory: Approximately 19.46 Mbits of RAM reduces external memory requirements and simplifies system architecture.
• Substantial I/O capacity: 432 I/Os allow flexible interfacing with multiple peripherals, sensors, and high‑bandwidth buses.
• Industry‑standard packaging: 1152‑FBGA (35×35) package supports surface‑mount assembly and high‑density board layouts.
• Controlled core supply range: Defined 870 mV–930 mV supply specification supports predictable power planning and decoupling design.
• RoHS compliance: Aligns with environmental requirements for lead‑free manufacturing.

Why Choose 5SGSMD4H3F35C2G?

The 5SGSMD4H3F35C2G combines substantial programmable logic capacity, multi‑megabit on‑chip RAM, and a large I/O count in a compact FCBGA package, making it a compelling choice for complex, high‑density FPGA implementations within commercial temperature environments. Its defined core supply range and RoHS compliance simplify integration into modern board designs and manufacturing flows.

This device suits engineering teams and procurement looking for a high‑capacity Stratix V GS FPGA with verifiable electrical and package specifications, enabling scalable designs supported by Intel’s Stratix V device documentation.

Request a quote or submit a pricing inquiry to begin evaluating the 5SGSMD4H3F35C2G for your next programmable‑logic design.