5SGSMD4H3F35I4N

The 5SGSMD4H3F35I4N is an Intel Stratix V GS field programmable gate array (FPGA) provided in an industrial temperature grade. It delivers very large programmable logic capacity and embedded RAM for designs that require substantial on‑chip resources and high I/O density.

This device is specified with a core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C. The Stratix V device family datasheet covers the device electrical and switching characteristics, including transceiver and I/O timing information relevant to this family.

Key Features

• Core Logic — 360,000 logic elements providing extensive capacity for complex custom logic and large FPGA designs; includes 135,840 LABs as specified.
• Embedded Memory — Approximately 19.5 Mbits of on‑chip RAM to implement large buffers, FIFOs, and memory‑intensive logic functions directly on die.
• I/O Density — 432 general‑purpose I/O pins to support wide parallel interfaces and extensive external connectivity.
• Power Supply — Core voltage support from 820 mV to 880 mV for devices designed around Stratix V core operating requirements.
• Package & Mounting — Supplied in a 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount package suitable for high‑density PCB designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature‑sensitive environments where industrial range is required.
• Compliance — RoHS compliant as declared in the product data.

Typical Applications

• High‑density FPGA implementations — Use the large logic element count and on‑chip RAM when implementing complex or large‑scale programmable logic functions.
• Systems requiring wide I/O — Leverage 432 I/O pins for parallel interfaces, multi‑lane connectivity, or extensive peripheral interfacing.
• Industrial temperature deployments — Deploy in environments needing operation across −40 °C to 100 °C while retaining high logic and memory capacity.

Unique Advantages

• Substantial on‑chip resources: 360,000 logic elements combined with approximately 19.5 Mbits of embedded RAM reduce dependence on external memory and simplify board design.
• High I/O count: 432 I/O pins support complex interfacing requirements and reduce external bridging or multiplexing.
• Industrial thermal range: Operation from −40 °C to 100 °C enables deployment in temperature‑sensitive systems without additional qualification claims beyond the stated grade.
• Dense, surface‑mount package: 1152‑BBGA (35×35) packaging supports compact PCB implementations while providing the pin count required for high‑bandwidth designs.
• RoHS compliant: Meets RoHS environmental requirements as declared, supporting regulatory needs for many production environments.

Why Choose 5SGSMD4H3F35I4N?

The 5SGSMD4H3F35I4N brings together large programmable logic capacity, significant on‑chip RAM, and a high I/O count in an industrial‑grade Stratix V GS FPGA package. These characteristics make it appropriate for designs that need extensive on‑die resources, robust I/O capability, and operation across a wide temperature range.

As part of the Intel Stratix V family, this device is documented within the family datasheet that covers electrical, switching, and I/O timing characteristics relevant to Stratix V GS devices. Choose this part when your design requires scalable logic density, abundant embedded memory, and a high‑pin‑count surface‑mount package.

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