5SGSMD4K1F40C1N

The 5SGSMD4K1F40C1N is an Intel Stratix® V GS field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package. This commercial-grade device is built on the Stratix V family architecture and targets high-performance, transceiver- and DSP-centric applications.

Key on-chip resources include 360,000 logic elements, approximately 19.456 Mbits of embedded memory, and 696 I/O pins. The device operates within a core supply range of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Architecture (Stratix V family)  28‑nm Stratix V architecture with an enhanced core and integrated hard IP blocks designed for bandwidth- and DSP-centric designs.
• Logic Capacity  360,000 logic elements for complex combinational and sequential logic implementation.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM (total RAM bits: 19,456,000) to support buffering, packet processing, and intermediate storage.
• DSP and Transceiver Capabilities  As a Stratix V GS device family member, it supports abundant variable-precision DSP blocks and integrated transceivers (family-level capabilities targeted at transceiver-based DSP applications).
• I/O and Package  696 device I/O pins in a 1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting.
• Power and Temperature  Core supply range 870 mV–930 mV; commercial operating temperature range 0 °C–85 °C.
• Commercial Grade and Compliance  Classified as commercial grade and RoHS compliant for standard industrial procurement and assembly processes.

Typical Applications

• High-performance DSP systems  Leverage the Stratix V GS family’s variable-precision DSP resources for signal processing, filtering, and compute-heavy algorithms.
• Optical and Backplane Interfaces  Family-level integrated transceivers and high I/O count support high-bandwidth serial interfaces and backplane connectivity.
• Network and Packet Processing  Large logic capacity and on-chip memory enable complex packet-processing pipelines and buffering for 40G/100G applications.
• Prototyping for ASIC Migration  Stratix V devices provide a low-risk prototyping path toward HardCopy ASIC implementation for higher-volume production.

Unique Advantages

• High logic density: 360,000 logic elements allow integration of large, multi-function hardware designs without immediate partitioning across multiple devices.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O: 696 I/O pins in a compact 1517-BBGA package enable dense interfacing to high-speed PHYs, serializers, and peripheral subsystems.
• Family-level DSP and transceiver capabilities: The Stratix V GS family’s focus on variable-precision DSP and integrated transceivers aligns the device with demanding signal-processing and bandwidth-centric designs.
• Commercial temperature and RoHS compliance: Commercial operating range (0 °C–85 °C) and RoHS status simplify procurement and assembly for a broad set of applications.
• Surface-mount package: 1517-FBGA (40×40) supplier package supports standard surface-mount assembly workflows.

Why Choose 5SGSMD4K1F40C1N?

The 5SGSMD4K1F40C1N positions itself as a high-capacity Stratix V GS FPGA option for designs that demand substantial logic, on-chip memory, and extensive I/O in a commercial-grade surface-mount package. Its alignment with the Stratix V family’s DSP and transceiver feature set makes it suitable for high-throughput signal-processing, networking, and prototyping workflows that may transition to HardCopy ASICs for volume production.

Choose this device when your design requires a balance of logic capacity, embedded memory, and I/O density backed by the Stratix V architecture and Intel’s device roadmap for prototyping-to-ASIC migration.

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