5SGSMD4H2F35I3G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 563 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H2F35I3G – Stratix® V GS FPGA, 360,000 Logic Elements, 1152‑BBGA

The 5SGSMD4H2F35I3G is an Intel Stratix® V GS field programmable gate array (FPGA) offered in an industrial temperature grade. It provides high-density programmable logic with substantial embedded memory and a large I/O count, delivered in a compact 1152‑ball FCBGA package.

Key on-chip resources include 360,000 logic elements and approximately 19.456 Mbits of embedded RAM, with a core supply range of 0.820 V to 0.880 V and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity  Offers 360,000 logic elements to support large, complex FPGA designs.
  • Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM for buffering, state storage, and algorithm acceleration.
  • I/O Resources  432 user I/O pins to accommodate broad interface and connectivity requirements.
  • Power and Core Voltage  Core voltage specified between 820 mV and 880 mV, enabling defined power domain planning.
  • Package and Mounting  1152‑BBGA (FCBGA) supplier package (1152‑FBGA, 35×35), surface mount for compact board integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial environments.
  • RoHS Compliant  Meets RoHS requirements for environmental compliance.

Unique Advantages

  • High-density programmable fabric: 360,000 logic elements provide the capacity required for complex logic, algorithm implementation, and large IP integrations.
  • Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and data‑path tasks.
  • Extensive I/O: 432 I/O pins offer flexibility for multi‑lane interfaces, parallel data buses, and mixed-signal front ends.
  • Industrial robustness: Specified operation down to −40 °C and up to 100 °C supports deployment in industrial environments.
  • Compact, manufacturable package: 1152‑BBGA (35×35) surface‑mount package balances board area efficiency with high pin count.
  • Standards and compliance: RoHS compliance supports regulated product development and manufacturing.

Why Choose 5SGSMD4H2F35I3G?

The 5SGSMD4H2F35I3G positions itself as a high‑capacity, industrial‑grade Stratix V GS FPGA suited to designs that require a large programmable fabric, generous embedded memory, and substantial I/O in a compact FCBGA package. Its defined core voltage range and wide operating temperature window support reliable integration into temperature‑sensitive and power‑managed systems.

For engineering teams and procurement focused on scalable FPGA resources, this device delivers a balance of logic density, on‑chip RAM, and I/O flexibility with environmental compliance for industrial applications.

Request a quote or submit an inquiry for pricing and availability for the 5SGSMD4H2F35I3G.

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