5SGSMD4H1F35C2WN

The 5SGSMD4H1F35C2WN is a Stratix V GS family field programmable gate array (FPGA) from Intel. It delivers very large on‑chip logic and memory resources in a 1152‑ball FCBGA package targeted at commercial‑temperature designs.

With 360,000 logic elements, approximately 19.46 Mbits of embedded RAM, and 432 general‑purpose I/O pins, this device is designed for system designs that require high integration density, substantial I/O capacity, and tight core voltage operation (870 mV to 930 mV).

Key Features

• High Logic Capacity  360,000 logic elements provide large-scale programmable logic for complex digital functions.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support buffering, data tables, and state storage.
• Extensive I/O  432 I/O pins support broad interfacing and system connectivity requirements.
• Power and Core Voltage  Core supply range of 870 mV to 930 mV for specified operating conditions.
• Package and Mounting  1152‑BBGA (FCBGA) package, supplier package 1152‑FBGA (35×35); surface‑mount device suited for board‑level integration.
• Operating Grade and Temperature  Commercial grade rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High‑density digital systems  Implement large, integrated digital functions that benefit from 360,000 logic elements and extensive on‑chip memory.
• Data buffering and packet processing  Use the approximately 19.46 Mbits of embedded RAM for FIFO buffers, packet queues, and temporary data storage.
• Multi‑I/O control and aggregation  432 I/Os enable aggregation of multiple parallel interfaces, board‑level bridging, and system control functions.

Unique Advantages

• Large on‑chip resources: 360,000 logic elements plus substantial embedded RAM reduce the need for external logic and memory devices.
• High I/O count: 432 I/Os simplify board routing and allow direct connections to numerous peripherals and subsystems.
• Commercial temperature rating: Rated 0 °C to 85 °C for mainstream commercial applications.
• Compact FCBGA package: 1152‑ball FCBGA (35×35) balances high integration with a surface‑mount form factor for production boards.
• Standards compliance: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGSMD4H1F35C2WN?

The 5SGSMD4H1F35C2WN offers a combination of high logic density, significant embedded memory, and a large I/O complement in a production‑ready FCBGA package. Its commercial temperature grade and RoHS compliance make it suitable for a wide range of mainstream electronic systems that require consolidated digital processing and extensive interfacing.

Backed by the Stratix V family documentation and Intel production support, this FPGA is suited to designers and teams building scalable, integration‑heavy systems where minimizing external components and maximizing on‑chip resources are priorities.

Request a quote or contact sales to discuss availability, lead times, and pricing for the 5SGSMD4H1F35C2WN.