5SGSMD4H1F35I2WN

The 5SGSMD4H1F35I2WN is a Stratix V GS Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable fabric with substantial embedded memory and a large I/O count for complex, resource-intensive designs.

Targeted at applications that require significant logic capacity and on-chip RAM, this device combines 360,000 logic elements with approximately 19.46 Mbits of embedded memory and up to 432 I/Os, all in a 1152-BBGA (35×35) surface-mount package.

Key Features

• Programmable Logic Capacity  360,000 logic elements to support large-scale logic implementations and complex custom functions.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for buffering, caching, and algorithm state storage.
• I/O Density  432 general-purpose I/O pins to enable extensive peripheral interfacing and system connectivity.
• Power Supply  Core voltage supply range from 870 mV to 930 mV to match platform power rails and design margins.
• Package and Mounting  1152-BBGA, FCBGA (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for compact system integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for use in environments requiring extended temperature range.
• Regulatory Compliance  RoHS compliant to meet standard environmental and materials requirements.
• Documentation  Detailed device datasheet available covering electrical and switching characteristics, operating conditions, and I/O timing.

Typical Applications

• High-density logic designs  Implements large custom logic blocks and complex state machines using a high count of logic elements.
• On-chip memory–intensive functions  Leverages approximately 19.46 Mbits of embedded RAM for buffering, packet processing, and intermediate data storage.
• Systems with extensive I/O requirements  Uses up to 432 I/Os for broad peripheral interfacing, multi-lane connectivity, or board-level signal aggregation.

Unique Advantages

• Large programmable fabric: 360,000 logic elements provide the capacity to implement sizable, integrated digital systems on a single device.
• Significant on-chip RAM: Approximately 19.46 Mbits of embedded memory reduces dependence on external memory for many architectures.
• High I/O count: 432 I/Os enable flexible system partitioning and direct connection to numerous peripherals or interfaces.
• Industrial temperature range: −40 °C to 100 °C operation supports deployment in environments with wide temperature variation.
• Compact BGA footprint: 1152-BBGA (35×35) surface-mount package provides high density in board-level designs while supporting robust mechanical mounting.
• Standards-conscious design: RoHS compliance supports materials and environmental requirements for modern electronics platforms.

Why Choose 5SGSMD4H1F35I2WN?

The 5SGSMD4H1F35I2WN offers a combination of high logic density, substantial embedded memory, and a large I/O complement in an industrial-temperature BGA package. This balance makes it suitable for designs that consolidate multiple functions into a single programmable device while maintaining the thermal and electrical operating margins required for demanding applications.

Supported by comprehensive device documentation that details electrical, switching, and I/O timing characteristics, this Stratix V GS FPGA is well suited for teams that require predictable implementation capacity, long-term platform stability, and the flexibility of in-system reprogrammability.

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