5SGSMD4H1F35I2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 19456000 360000 1152-BBGA, FCBGA

Quantity 11 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs135840Number of Logic Elements/Cells360000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGSMD4H1F35I2N – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSMD4H1F35I2N is a Stratix V GS variant FPGA in a 1152-BBGA (35 × 35) FCBGA package, designed for DSP-centric, transceiver-enabled system designs. It combines a high logic capacity with abundant embedded memory, variable-precision DSP resources, and integrated transceivers to address data-intensive and bandwidth-centric applications.

Target use cases include wireline and optical communications, military and broadcast systems, and high-performance computing where high-throughput DSP, large I/O counts, and industrial temperature operation are required.

Key Features

  • Core process and architecture — Built on the Stratix V family architecture using a 28‑nm process; the family includes enhanced adaptive logic modules (ALMs) and a comprehensive fabric clocking network.
  • Logic capacity — 360,000 logic elements to implement complex control, packet-processing, and DSP-centric logic functions.
  • Embedded memory — Approximately 19.456 Mbits of on-chip RAM (M20K memory blocks) for buffering, packet storage, and intermediate DSP data.
  • High-performance DSP — Abundant variable-precision DSP blocks in the GS variant, supporting up to 3,926 18×18 or 1,963 27×27 multipliers for intensive signal-processing workloads.
  • Transceiver capability — GS devices include integrated transceivers with 14.1 Gbps data-rate capability; the Stratix V family supports transceiver options across a wide range, enabling backplane and optical interfaces.
  • I/O and package — 432 user I/Os in a 1152‑BBGA (35 × 35) FCBGA surface-mount package for high-density board integration.
  • Power — Core voltage supply range of 870 mV to 930 mV, consistent with Stratix V family core-voltage options.
  • Industrial temperature and reliability — Qualified for operation from −40 °C to 100 °C and listed as industrial grade for demanding environments.
  • Embedded hard IP and prototyping path — Includes an Embedded HardCopy Block for hard IP instantiation (PCIe Gen3/Gen2/Gen1 as part of family capabilities) and supports a low-risk path to HardCopy V ASIC migration.

Typical Applications

  • High-performance DSP systems — Leverage the large pool of variable-precision DSP blocks and multipliers for real-time signal processing, filtering, and transforms.
  • Optical and backplane communications — Integrated transceivers and high I/O count make the device suitable for 40G/100G transport, backplane interfaces, and related packet-processing functions.
  • Military and broadcast equipment — Industrial temperature rating and robust logic/memory resources support demanding communications and signal-processing payloads.
  • Network and data-center acceleration — Large logic capacity, embedded memory, and transceiver capability enable acceleration of packet processing and bandwidth-centric workloads.

Unique Advantages

  • High logic and memory integration: 360,000 logic elements and approximately 19.456 Mbits of embedded RAM reduce external memory needs and simplify board design.
  • DSP-dense architecture: GS variant DSP resources and multiplier density support complex, high-precision signal-processing algorithms on-chip.
  • Transceiver-enabled connectivity: Integrated 14.1 Gbps-capable transceivers (GS variant) facilitate high-bandwidth links for optical and backplane interfaces.
  • Industrial operation: Specified for −40 °C to 100 °C operation, suitable for systems deployed in harsh environments.
  • Prototype-to-ASIC path: Embedded HardCopy capabilities and family-level support for HardCopy V ASICs provide a development path from FPGA prototype to production ASIC.
  • High I/O density in a compact package: 432 I/Os in a 1152‑BBGA (35 × 35) surface-mount package for dense system integration without sacrificing signal access.

Why Choose 5SGSMD4H1F35I2N?

The 5SGSMD4H1F35I2N positions Stratix V GS architecture into a device optimized for DSP-heavy and transceiver-enabled applications, delivering a balance of logic capacity, on-chip memory, and dedicated DSP multipliers. Its industrial temperature range and high I/O count make it suitable for demanding communications, broadcast, and compute-acceleration designs.

Engineers seeking a Stratix V GS device will find a clear development and production path supported by embedded hard IP and options to migrate successful FPGA implementations toward HardCopy V ASICs, helping manage long-term cost and production scaling.

Request a quote or submit a product inquiry to receive pricing, lead-time, and availability information for 5SGSMD4H1F35I2N.

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