5SGSMD4H1F35C2LG

The 5SGSMD4H1F35C2LG is a Stratix® V GS field programmable gate array (FPGA) packaged in a 1152‑BBGA FCBGA (supplier package: 1152‑FBGA (35×35)) for surface‑mount assembly. It provides a large logic capacity and on‑chip memory suitable for designs that require significant programmable logic and embedded RAM.

Key device characteristics include 360,000 logic elements, approximately 19.5 Mbits of embedded memory, 432 user I/Os, a supply voltage range of 820 mV to 880 mV, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  360,000 logic elements for high‑density programmable logic implementations.
• Embedded Memory  Approximately 19.5 Mbits of on‑chip RAM to support large data buffering and intermediate storage.
• I/O  432 user I/O pins to support complex interfacing and multi‑channel connectivity.
• Package & Mounting  1152‑BBGA (FCBGA) surface‑mount package; supplier package specified as 1152‑FBGA (35×35).
• Power  Core supply voltage range: 820 mV to 880 mV, enabling designs that target this supply window.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory and environmental conformity.

Typical Applications

• Dense programmable logic designs  Use where 360,000 logic elements are required to implement complex digital functions and custom logic blocks.
• Embedded memory‑intensive functions  Suitable for designs that need approximately 19.5 Mbits of on‑chip RAM for buffering, FIFOs, or scratch‑pad storage.
• High‑pin‑count interfacing  Ideal for systems requiring a large number of I/Os (432) for parallel buses, multi‑lane interfaces, or mixed I/O signaling.

Unique Advantages

• High logic density: 360,000 logic elements provide extensive programmable resources to implement large-scale logic and accelerators.
• Substantial embedded RAM: Approximately 19.5 Mbits of on‑chip memory reduces reliance on external SRAM/DRAM for many buffering and data‑storage tasks.
• Generous I/O count: 432 I/Os enable flexible system partitioning and support for multiple parallel interfaces.
• Robust packaging for surface mount assembly: 1152‑BBGA (FCBGA) with supplier package 1152‑FBGA (35×35) balances thermal and routing considerations for dense PCBs.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to match commercial deployment environments.
• Regulatory compliance: RoHS compliance supports environmentally conscious designs and procurement requirements.

Why Choose 5SGSMD4H1F35C2LG?

The 5SGSMD4H1F35C2LG Stratix® V GS FPGA combines substantial logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package. Its specifications make it a fit for complex programmable designs that need large on‑chip resources while maintaining surface‑mount PCB compatibility and commercial temperature operation.

Engineers and procurement teams targeting high‑density programmable solutions can leverage this device for scalable designs that demand extensive logic and memory on a single FPGA package, with the assurance of RoHS compliance and a clearly specified supply voltage and operating temperature range.

Request a quote or submit a procurement inquiry to learn more about availability, pricing, and design support for the 5SGSMD4H1F35C2LG.