5SGSMD4H1F35C1WN

The 5SGSMD4H1F35C1WN is a Stratix® V GS field programmable gate array (FPGA) IC from Intel, offered in a commercial temperature grade. It delivers high on-chip logic and memory capacity combined with a large I/O count in a 1152-BBGA FCBGA package, aimed at designs that require substantial programmable logic, embedded RAM, and broad I/O integration.

Documented in the Stratix V device datasheet, this device is suitable for applications that leverage dense logic resources and significant embedded memory while operating within commercial temperature and voltage conditions.

Key Features

• Core Capacity 360,000 logic elements for implementing large-scale combinational and sequential logic designs.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions.
• I/O Resources 432 user I/Os to accommodate wide parallel interfaces, multi-channel connectivity, and complex board-level integration.
• Power Supply Core voltage supply specified from 870 mV to 930 mV, reflecting the device's defined operating supply range.
• Package & Mounting 1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35 × 35 mm) with surface-mount assembly for compact system integration.
• Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
• Documentation Electrical and switching characteristics, including operating conditions and I/O timing, are provided in the Stratix V device datasheet.

Typical Applications

• High-density logic implementations Use the abundant logic elements to realize complex state machines, protocol engines, or custom datapath implementations.
• Memory-intensive designs Leverage approximately 19.456 Mbits of embedded RAM for buffering, packet queues, or on-chip data structures.
• Multi-interface systems The 432 I/Os support boards that require numerous parallel interfaces, wide buses, or mixed I/O connectivity.
• Compact system integration The 1152-BBGA FCBGA package enables integration into space-constrained, surface-mount PCBs.

Unique Advantages

• High logic density: 360,000 logic elements provide headroom for large RTL designs and complex functions on a single device.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-path tasks.
• Large I/O complement: 432 I/Os simplify board-level connectivity and reduce the need for external multiplexing or I/O expanders.
• Defined core voltage range: Specified 870 mV–930 mV supply gives clear electrical parameters for power delivery planning.
• Compact BGA footprint: 1152-BBGA (35 × 35 mm) package provides a balance of pin count and board area for high-density designs.
• Commercial availability: Rated for 0 °C to 85 °C operation to meet standard commercial system requirements.

Why Choose 5SGSMD4H1F35C1WN?

The 5SGSMD4H1F35C1WN positions itself as a high-capacity Stratix V GS FPGA optimized for applications requiring a combination of extensive programmable logic, significant on-chip RAM, and a large number of I/Os within a compact BGA package. Its defined voltage supply and commercial temperature rating make it suitable for mainstream embedded and communications products operating in standard commercial environments.

Designers seeking a scalable, documented Stratix V device can rely on the published electrical and switching characteristics found in the Stratix V device datasheet to plan power, timing, and thermal aspects of their systems.

Request a quote or submit a sales inquiry today to evaluate 5SGSMD4H1F35C1WN for your next design.