5SGSMD4E3H29I4N

The 5SGSMD4E3H29I4N is a Stratix® V GS field programmable gate array (FPGA) IC from Intel, delivered in a 780-BBGA (FCBGA) package. It provides a high-density programmable fabric with 360,000 logic elements, approximately 19.456 Mbits of embedded memory, and 360 user I/Os for complex digital integration.

Targeted for industrial-temperature applications, this surface-mount FPGA operates from 820 mV to 880 mV core supply and supports an operating range of −40 °C to 100 °C, making it suitable for designs that require large logic capacity, substantial on-chip memory, and robust I/O count in a compact BGA form factor.

Key Features

• Core Logic  360,000 logic elements provide the programmable fabric required for large-scale digital designs and complex logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to store buffers, lookup tables, and intermediate datasets for high-throughput logic pipelines.
• I/O Capacity  360 user I/Os for broad peripheral connectivity, parallel interfaces, and multi-channel signal routing.
• Power/Voltage  Core supply range of 820 mV to 880 mV to match low-voltage system domains while supporting the Stratix V device family electrical requirements.
• Package & Mounting  780-BBGA (FCBGA) supplier package (780-HBGA, 33×33) in a surface-mount footprint for dense board-level integration.
• Operating Range & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Standards & Compliance  RoHS-compliant construction to meet regulatory environmental requirements.

Typical Applications

• High-density logic integration  Implement large custom logic blocks and complex state machines using 360,000 logic elements and substantial embedded RAM.
• Data buffering and packet processing  Approximately 19.456 Mbits of on-chip memory supports buffering, packet queues, and intermediate data storage for throughput-sensitive designs.
• Multi-interface control  Use the 360 I/Os to connect to multiple peripherals, parallel buses, and mezzanine interfaces in embedded systems and instrumentation.
• Industrial automation and control  Industrial-grade temperature rating (−40 °C to 100 °C) and surface-mount BGA packaging enable deployment in robust industrial environments.

Unique Advantages

• High logic capacity: 360,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system component count.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM lowers dependence on external memory for many buffering and processing tasks.
• Extensive I/O availability: 360 user I/Os give designers flexibility for parallel interfaces, sensor arrays, and high-pin-count subsystems.
• Industrial-temperature rated: Specified −40 °C to 100 °C operation supports deployments in temperature-demanding applications.
• Compact BGA package: 780-BBGA (780-HBGA, 33×33) surface-mount package enables high-density PCB routing and small board footprints.
• RoHS compliant and manufacturer-backed: Built to environmental compliance and supplied by Intel as part of the Stratix V device family with available device datasheet documentation.

Why Choose 5SGSMD4E3H29I4N?

The 5SGSMD4E3H29I4N combines a large programmable fabric, substantial embedded memory, and a high I/O count in a compact 780-BBGA package, aimed at industrial-temperature designs that require integration of complex logic and memory-intensive functions. Its core voltage range and RoHS compliance align with modern low-voltage system architectures and environmental requirements.

This device is appropriate for engineers and system architects seeking a single-chip solution to reduce BOM and simplify board-level design while maintaining the flexibility of an FPGA. Available datasheet documentation for the Stratix V family supports electrical and switching characteristics for robust system development and validation.

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